SNAS758A February   2025  – June 2025 HDC3120

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power-Up
      2. 7.3.2 Device Disable and Enable
      3. 7.3.3 Conversion of the Signal Output
        1. 7.3.3.1 Relative Humidity (RH%) Measurement
        2. 7.3.3.2 Temperature Measurement
      4. 7.3.4 NIST Traceability and Unique ID
      5. 7.3.5 Output Short Circuit Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 On-Chip Heater
        1. 7.4.1.1 Operating Principle
          1. 7.4.1.1.1 Heater Configuration Example
        2. 7.4.1.2 Heater Electrical Behavior
        3. 7.4.1.3 Heater Temperature Increase
        4. 7.4.1.4 Heater Usage Guidelines
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Rehydration Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
    6. 8.6 Storage and PCB Assembly
      1. 8.6.1 Storage and Handling
      2. 8.6.2 Product Storage
      3. 8.6.3 PCB Assembly Flow
      4. 8.6.4 Rework Consideration
      5. 8.6.5 Sensitivity to Chemicals and Vapors
      6. 8.6.6 Exposure to High Temperature and High Humidity Conditions
      7. 8.6.7 Recovering Sensor Performance: Bake and Rehydration Procedure
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Device Disable and Enable

The HDC3120 can be disabled by setting the RESET_EN pin low (below VIL). In this state, the RH and Temp DAC outputs move to a near-zero condition (VOUT_DISABLE), and the device current consumption is significantly reduced to IDD_DISABLE. The reduced current consumption helps conserve the system power if no sensor measurement is needed. The device disable sequence and the DAC output voltages are illustrated in Figure 7-5.

HDC3120 HDC3120 Disable BehaviorFigure 7-5 HDC3120 Disable Behavior

To enable the HDC3120, the RESET_EN pin needs to be set to high (above VIH). The enabling sequence and the sensor output voltages behave similarly to the device power-up, as described in Section 7.3.1. After the RESET_EN pin is raised above VIH, the device loads the default settings from the memory and subsequently performs temperature and humidity measurements. During the first temperature and humidity measurement, the DAC outputs are driven to a default level of 0.1× VDD. Each DAC channel remains at the default voltage level until the measurement is completed, which takes approximately RHPUR for the humidity measurement and TPUR for the temperature measurement. After the measurement is completed, the DAC outputs are driven to the voltage level corresponding to the measured humidity and temperature values. Figure 7-6 illustrates the HDC3120 enable sequence.

HDC3120 HDC3120 Enable BehaviorFigure 7-6 HDC3120 Enable Behavior

Note the HDC3120 RESET_EN pin has a weak 51kΩ internal pull-up to VDD, thus the pin can be left floating is the RESET or the Disable functions are not utilized.