SNAS758A February   2025  – June 2025 HDC3120

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power-Up
      2. 7.3.2 Device Disable and Enable
      3. 7.3.3 Conversion of the Signal Output
        1. 7.3.3.1 Relative Humidity (RH%) Measurement
        2. 7.3.3.2 Temperature Measurement
      4. 7.3.4 NIST Traceability and Unique ID
      5. 7.3.5 Output Short Circuit Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 On-Chip Heater
        1. 7.4.1.1 Operating Principle
          1. 7.4.1.1.1 Heater Configuration Example
        2. 7.4.1.2 Heater Electrical Behavior
        3. 7.4.1.3 Heater Temperature Increase
        4. 7.4.1.4 Heater Usage Guidelines
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Rehydration Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
    6. 8.6 Storage and PCB Assembly
      1. 8.6.1 Storage and Handling
      2. 8.6.2 Product Storage
      3. 8.6.3 PCB Assembly Flow
      4. 8.6.4 Rework Consideration
      5. 8.6.5 Sensitivity to Chemicals and Vapors
      6. 8.6.6 Exposure to High Temperature and High Humidity Conditions
      7. 8.6.7 Recovering Sensor Performance: Bake and Rehydration Procedure
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.6 Typical Characteristics

TA = 25°C, VDD = 1.62V to 5.5V (unless otherwise noted)

HDC3120 RH Accuracy vs RH Set Point (VDD = 1.62V-5.5V)Figure 6-1 RH Accuracy vs RH Set Point (VDD = 1.62V-5.5V)
HDC3120 TA Accuracy vs TA Set PointFigure 6-3 TA Accuracy vs TA Set Point
HDC3120 Thermal Response Time (Stirred Liquid)Figure 6-5 Thermal Response Time (Stirred Liquid)
HDC3120 Sampling Time Variation vs TemperatureFigure 6-7 Sampling Time Variation vs Temperature
HDC3120 DAC PSR vs FrequencyFigure 6-9 DAC PSR vs Frequency
HDC3120 Disable Mode Current vs TemperatureFigure 6-11 Disable Mode Current vs Temperature
HDC3120 Start-up Response
VDD rise time = 1µs
Figure 6-13 Start-up Response
HDC3120 Start-up Response
VDD rise time = 50ms
Figure 6-15 Start-up Response
HDC3120 Enable Response
RESET_EN: 0V to 3.5V
Figure 6-17 Enable Response
HDC3120 Heater Resistance vs TemperatureFigure 6-19 Heater Resistance vs Temperature
HDC3120 Output Impedance vs FrequencyFigure 6-21 Output Impedance vs Frequency
HDC3120 RH Typical Accuracy vs TA Set PointFigure 6-2 RH Typical Accuracy vs TA Set Point
HDC3120 Relative Humidity Response TimeFigure 6-4 Relative Humidity Response Time
HDC3120 Thermal Response Time (Still Air)Figure 6-6 Thermal Response Time (Still Air)
HDC3120 Active Current vs TemperatureFigure 6-8 Active Current vs Temperature
HDC3120 DAC Output Noise Density vs FrequencyFigure 6-10 DAC Output Noise Density vs Frequency
HDC3120 Disable Mode Output Voltage vs TemperatureFigure 6-12 Disable Mode Output Voltage vs Temperature
HDC3120 Power-down Response
VDD fall time = 1µs
Figure 6-14 Power-down Response
HDC3120 Power-down Response
VDD fall time = 50ms
Figure 6-16 Power-down Response
HDC3120 Disable Response
RESET_EN: 3.5V to 0V
Figure 6-18 Disable Response
HDC3120 Heater Current vs TemperatureFigure 6-20 Heater Current vs Temperature