SNIS177C March   2013  – May 2025 LMT90

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT90 Transfer Function
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitive Loads
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. Device and Documentation Support
    1.     Related Documentation
    2. 9.1 Receiving Notification of Documentation Updates
    3. 9.2 Support Resources
    4. 9.3 Trademarks
    5. 9.4 Electrostatic Discharge Caution
    6. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Layout Guidelines

The LMT90 can be applied easily in the same way as other integrated-circuit temperature sensors. The device can be glued or cemented to a surface and the temperature is within about 0.2°C of the surface temperature.

This presumes that the ambient air temperature is approximately the same as the surface temperature; if the air temperature are much higher or lower than the surface temperature, the actual temperature of the LMT90 die is at an intermediate temperature between the surface temperature and the air temperature.

To provide good thermal conductivity, the backside of the LMT90 die is directly attached to the GND pin. The lands and traces to the device is part of the printed-circuit board, which is the object whose temperature is being measured. These printed-circuit board lands and traces do not cause the LMT90 temperature to deviate from the desired temperature.

Alternatively, the LMT90 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any device, the LMT90 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit can operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as HUMISEAL® and epoxy paints or dips are often used to verify that moisture cannot corrode the device or the connections.