SNIS177C March   2013  – May 2025 LMT90

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT90 Transfer Function
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitive Loads
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1.     Related Documentation
    2. 9.1 Receiving Notification of Documentation Updates
    3. 9.2 Support Resources
    4. 9.3 Trademarks
    5. 9.4 Electrostatic Discharge Caution
    6. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.5.3 Thermal Considerations

Table 8-2 summarizes the thermal resistance of the LMT90 for different conditions.

Table 8-2 Temperature Rise of LMT90 Due to Self-Heating
RθJA (°C/W)
SOT-23No heat sink(1)Still air
(Legacy chip)

450

Moving air
(Legacy chip)

-

Small heat fin(2)Still air
(Legacy chip)

260

Moving air
(Legacy chip)

180

(1) Part soldered to 30 gauge wire.
(2) Heat sink used is 0.5inch, square printed-circuit board with 2oz foil; part attached as shown in Figure 8-9.