SNIS177C March   2013  – May 2025 LMT90

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT90 Transfer Function
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitive Loads
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1.     Related Documentation
    2. 9.1 Receiving Notification of Documentation Updates
    3. 9.2 Support Resources
    4. 9.3 Trademarks
    5. 9.4 Electrostatic Discharge Caution
    6. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision B (September 2015) to Revision C (May 2025)

  • Updated the numbering forms for tables, figures, and cross-references throughout the documentGo
  • Updated the document to reflect the latest family format and standardsGo
  • Added specifications and graphs for the New device and compared the device with the Legacy Device throughout the documentGo
  • Added Device Comparison, Device Orderable Options, and Nomenclature Details tablesGo
  • Deleted Machine Model (MM) Electrostatic discharge.Go
  • Added DBZ package “Thermal Information” for the New chipGo
  • Added “Turn-on Time” for both Legacy chip and New chip.Go
  • Added “Operating current” and “Change of quiescent current” for the New chip.Go

Changes from Revision A (March 2013) to Revision B (September 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo