SNLS315I April   2010  – June 2026 LMH0387

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Control Pin Electrical Characteristics
    6. 5.6  Input Mode (Equalizer) DC Electrical Characteristics
    7. 5.7  Output Mode (Cable Driver) DC Electrical Characteristics
    8. 5.8  Input Mode (Equalizer) AC Electrical Characteristics
    9. 5.9  Output Mode (Cable Driver) AC Electrical Characteristics
    10. 5.10 Input Mode (Equalizer) SPI Interface AC Electrical Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Mode (Equalizer) Description
        1. 6.3.1.1 Input Interfacing
        2. 6.3.1.2 Output Interfacing
        3. 6.3.1.3 Carrier Detect (CD)
        4. 6.3.1.4 Carrier Detect Threshold (CDTHRESH)
        5. 6.3.1.5 Auto Sleep
      2. 6.3.2 Output Mode (Cable Driver) Description
        1. 6.3.2.1 Input Interfacing
        2. 6.3.2.2 Output Interfacing
        3. 6.3.2.3 Output Slew Rate Control
        4. 6.3.2.4 Output Enable
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
      1. 6.5.1 Output Mode (Cable Driver)
      2. 6.5.2 Input Mode (Equalizer)
      3. 6.5.3 Input Mode (Equalizer) SPI Register Access
        1. 6.5.3.1 SPI Write
        2. 6.5.3.2 SPI Read
        3. 6.5.3.3 Output Driver Adjustments (Register 01h)
          1. 6.5.3.3.1 Output Swing
          2. 6.5.3.3.2 Offset Voltage
        4. 6.5.3.4 Launch Amplitude Optimization (Register 02h)
          1. 6.5.3.4.1 Coarse Control
          2. 6.5.3.4.2 Fine Control
        5. 6.5.3.5 Cable Length Indicator (CLI) (Register 03h)
      4. 6.5.4 Input Mode (Equalizer) SPI Register Access
        1. 6.5.4.1 General Control (Register 00h)
          1. 6.5.4.1.1 Carrier Detect
          2. 6.5.4.1.2 Mute
          3. 6.5.4.1.3 Sleep Mode
          4. 6.5.4.1.4 Extended 3G Reach Mode
  8. 7 Register Maps
    1. 7.1 SPI Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) LMH0387 UNIT
NPD (TLGA)
48 PINS
RθJA Junction-to-ambient thermal resistance 64.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.8 °C/W
RθJB Junction-to-board thermal resistance 32.3 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 32 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.