SNOS751F April   2000  – June 2026 LM6132 , LM6134

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information LM6132
    5. 5.5  Thermal Information LM6134
    6. 5.6  Electrical Characteristics: VS = 5V
    7. 5.7  Electrical Characteristics: VS = 2.7V
    8. 5.8  Electrical Characteristics: VS = 24V
    9. 5.9  Typical Characteristics
    10. 5.10 Old Versus New Die Comparison
  7. 6Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Applications
      1. 6.2.1 Three Op Amp Instrumentation Amp with Rail-to-Rail Input and Output
      2. 6.2.2 Flat Panel Display Buffering
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Old Versus New Die Comparison

As of the publication of revision F of this data sheet, Texas Instruments has moved manufacturing of the die for LM6132 and LM6134 to a modern fabrication site. The two different die are referred to in this document as “old” (previous fabrication site) and “new” die. The die origin can be separated from the “Chip Source Origin” (CSO) parameter in the shipping information. The old die CSO is “GF6”, for the new die CSO is “RFB”. The old die information is maintained in this data sheet for comparison purposes, but all new manufacturing has moved to the new die.

Table 5-1 Old Versus New Die Comparison
Description Old Die New Die
Minimum supply voltage 1.8V 2.7V
Typical output voltage range for 100kΩ load (VS = 5V) 0.007V - 4.992V 0.03V - 4.97V
Minimum output voltage range for 100kΩ load (VS = 5V) 0.017V - 4.98V 0.04V - 4.965V
Output voltage slew architecture Standard slew architecture Slew-boosted architecture