SNOSB24C October   2008  – November 2025 LM5576-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Shutdown / Standby
      2. 6.3.2 Soft Start
      3. 6.3.3 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 High Voltage Start-Up Regulator
      2. 6.4.2 Oscillator and Sync Capability
      3. 6.4.3 Error Amplifier and PWM Comparator
      4. 6.4.4 Ramp Generator
      5. 6.4.5 Maximum Duty Cycle / Input Dropout Voltage
      6. 6.4.6 Boost Pin
      7. 6.4.7 Current Limit
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Bias Power Dissipation Reduction
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Custom Design With WEBENCH® Tools
        2. 7.2.2.2  External Components
        3. 7.2.2.3  R3 (RT)
        4. 7.2.2.4  L1
        5. 7.2.2.5  C3 (CRAMP)
        6. 7.2.2.6  C9, C10
        7. 7.2.2.7  D1
        8. 7.2.2.8  C1, C2
        9. 7.2.2.9  C8
        10. 7.2.2.10 C7
        11. 7.2.2.11 C4
        12. 7.2.2.12 R5, R6
        13. 7.2.2.13 R1, R2, C12
        14. 7.2.2.14 R7, C11
        15. 7.2.2.15 R4, C5, C6
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Power Dissipation
      4. 7.4.4 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

8.6 Electrostatic Discharge Caution

LM5576-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.