SNOSDG7A May   2025  – March 2026 TPS7H6101-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Timing Measurement
    2. 7.2 Deadtime Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Gate Drive Input Voltage
      2. 8.3.2  Linear Regulator Operation
      3. 8.3.3  Bootstrap Operation
        1. 8.3.3.1 Bootstrap Charging Methods
          1. 8.3.3.1.1 Internal Bootstrap Charging
          2. 8.3.3.1.2 Direct VIN Bootstrap Charging
          3. 8.3.3.1.3 Dual Bootstrap Charging
          4. 8.3.3.1.4 Two Switch Common Ground Reference
        2. 8.3.3.2 Bootstrap Capacitor
        3. 8.3.3.3 Bootstrap Diode
        4. 8.3.3.4 Bootstrap Resistor
      4. 8.3.4  High-Side Driver Startup
      5. 8.3.5  PWM_LI and EN_HI
      6. 8.3.6  Dead Time
      7. 8.3.7  Input Interlock Protection
      8. 8.3.8  Undervoltage Lockout and Power Good (PGOOD)
      9. 8.3.9  Negative Switch Node Voltage Transients
      10. 8.3.10 Level Shifter
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bootstrap and Bypass Capacitor
          1. 9.2.2.1.1 Bootstrap Capacitor
          2. 9.2.2.1.2 Input Capacitance
          3. 9.2.2.1.3 Internal Regulator Capacitor
        2. 9.2.2.2 Bootstrap Diode
      3. 9.2.3 Application Results
      4. 9.2.4 Double Pulse Characteristics
        1. 9.2.4.1 Double Pulse Testing Measurement
        2. 9.2.4.2 Double Pulse Testing Results
      5. 9.2.5 Thermal Characteristics
        1. 9.2.5.1 Foster RC Thermal Model
        2. 9.2.5.2 Applying Foster Thermal Networks
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Thermal Vias
        2. 9.4.1.2 HVIN Plane
        3. 9.4.1.3 Solder Mask Defined Pads
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.2.5.2 Applying Foster Thermal Networks

Combining foster networks with additional systems thermal resistances or impedance networks increases the fidelity of the overall system model, which provides improved junction temperature modeling. Applying the network in Figure 9-8, then apply a current source to the input terminal (RC1) corresponding to the modeled power dissipation profile; then add external system thermal resistances / impedance (board attach solder, PCB, chassis connection etc.). Implementing this network in common electrical simulation platforms provides a fast and efficient method for determining overall system performance.

TPS7H6101-SEP Transient Thermal ImpedanceFigure 9-7 Transient Thermal Impedance
TPS7H6101-SEP Foster Network
Foster network parameters:
HS LS
RTHi (°C/W) τi(s) RTHi (°C/W) τi(s)
1 237m 1μ 450m 1μ
2 135m 19μ 271m 19μ
3 118m 19μ 223m 19μ
4 232m 422μ 437m 438μ
5 284m 422μ 594m 445μ
6 10m 411μ 10m 411μ
7 293m 422μ 620m 447μ
8 349m 422μ 814m 456μ
9 326m 422μ 732m 452μ
10 400m 700μ 400m 700μ
Figure 9-8 Foster Network