SNOSDG7A May   2025  – March 2026 TPS7H6101-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Timing Measurement
    2. 7.2 Deadtime Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Gate Drive Input Voltage
      2. 8.3.2  Linear Regulator Operation
      3. 8.3.3  Bootstrap Operation
        1. 8.3.3.1 Bootstrap Charging Methods
          1. 8.3.3.1.1 Internal Bootstrap Charging
          2. 8.3.3.1.2 Direct VIN Bootstrap Charging
          3. 8.3.3.1.3 Dual Bootstrap Charging
          4. 8.3.3.1.4 Two Switch Common Ground Reference
        2. 8.3.3.2 Bootstrap Capacitor
        3. 8.3.3.3 Bootstrap Diode
        4. 8.3.3.4 Bootstrap Resistor
      4. 8.3.4  High-Side Driver Startup
      5. 8.3.5  PWM_LI and EN_HI
      6. 8.3.6  Dead Time
      7. 8.3.7  Input Interlock Protection
      8. 8.3.8  Undervoltage Lockout and Power Good (PGOOD)
      9. 8.3.9  Negative Switch Node Voltage Transients
      10. 8.3.10 Level Shifter
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bootstrap and Bypass Capacitor
          1. 9.2.2.1.1 Bootstrap Capacitor
          2. 9.2.2.1.2 Input Capacitance
          3. 9.2.2.1.3 Internal Regulator Capacitor
        2. 9.2.2.2 Bootstrap Diode
      3. 9.2.3 Application Results
      4. 9.2.4 Double Pulse Characteristics
        1. 9.2.4.1 Double Pulse Testing Measurement
        2. 9.2.4.2 Double Pulse Testing Results
      5. 9.2.5 Thermal Characteristics
        1. 9.2.5.1 Foster RC Thermal Model
        2. 9.2.5.2 Applying Foster Thermal Networks
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Thermal Vias
        2. 9.4.1.2 HVIN Plane
        3. 9.4.1.3 Solder Mask Defined Pads
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.2.5.1 Foster RC Thermal Model

A Foster RC thermal model network is a widely used electrical analog circuit for modeling thermal impedance in electronic components and systems. In this approach, thermal behavior is represented by a series of parallel RC (resistor-capacitor) branches connected in series, where each resistor represents a thermal resistance and each capacitor represents a thermal capacitance. The Foster model is particularly effective because the Foster model can accurately capture the multi-exponential nature of thermal transient responses typically observed in semiconductor devices and heat sinks. Each RC time constant in the network corresponds to different physical thermal phenomena occurring at various time scales - from rapid junction heating to slower thermal diffusion through packaging materials and heat spreaders. Figure 9-8 provides model parameters that are extracted from a thermal transient finite element analysis. The resulting network provides a computationally efficient way to predict temperature rise and thermal impedance as a function of time, making the Foster model an invaluable aid for thermal design, optimization, and reliability analysis in electronic systems.