SNOSDM8 December   2025 TLV9020L-Q1 , TLV9030L-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions: TLV9020L-Q1 and TLV9030L-Q1 Single
    2. 4.2 Pin Configurations: TLV9022L-Q1 and TLV9032L-Q1 Dual
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - Single
    5. 5.5 Thermal Information - Dual
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Outputs
        1. 6.4.1.1 TLV902xL-Q1 Open-Drain Output
        2. 6.4.1.2 TLV903xL-Q1 Push-Pull Output
      2. 6.4.2 Power-On Reset (POR)
        1. 6.4.2.1 TLV902xL-Q1 Open Drain Output POR Behavior
        2. 6.4.2.2 TLV903xL-Q1 Push-Pull Output POR Behavior
      3. 6.4.3 Output Latching
        1. 6.4.3.1 "L1" and "L2" Power-On Options
        2. 6.4.3.2 TLV902xL1-Q1 Open-Drain Latch Behavior
        3. 6.4.3.3 TLV902xL2-Q1 Open-Drain Latch Behavior
        4. 6.4.3.4 TLV903xL1-Q1 Push-Pull Latch Behavior
        5. 6.4.3.5 TLV903xL2-Q1 Push-Pull Latch Behavior
        6. 6.4.3.6 Clear (CLR) Input
      4. 6.4.4 Inputs
        1. 6.4.4.1 Rail to Rail Input
        2. 6.4.4.2 Fail-Safe Inputs
        3. 6.4.4.3 Input Protection
        4. 6.4.4.4 Internal Hysteresis
        5. 6.4.4.5 Unused Inputs
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
    2. 7.2 Typical Applications
      1. 7.2.1 Window Comparator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information - Single

THERMAL METRIC (1) TLV9020L-Q1,TLV9030-Q1 UNIT
DBV (SOT-23) DCK (SC-70) DSE (WSON)
6 PINS 6 PINS 6 PINS
RqJA Junction-to-ambient thermal resistance 181.2 210.5 - °C/W
RqJC(top) Junction-to-case (top) thermal resistance 99.6 143.9 - °C/W
RqJB Junction-to-board thermal resistance 63.1 64.7 - °C/W
yJT Junction-to-top characterization parameter 38.7 46.1 - °C/W
yJB Junction-to-board characterization parameter 62.9 64.5 - °C/W
RqJC(bot) Junction-to-case (bottom) thermal resistance - - - °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics note.