SNVSCQ9 November   2025 LM68425-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Device Comparison Table
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Selection
      2. 7.3.2 EN Pin and Use as VIN UVLO
      3. 7.3.3 Mode Selection
        1. 7.3.3.1 MODE/SYNC/TEMP Pin Uses for Synchronization
        2. 7.3.3.2 Clock Locking
      4. 7.3.4 Adjustable Switching Frequency
      5. 7.3.5 Dual Random Spread Spectrum (DRSS)
      6. 7.3.6 Internal LDO, VCC UVLO, and BIAS Input
      7. 7.3.7 Bootstrap Voltage (BST Pin)
      8. 7.3.8 Soft Start and Recovery From Dropout
      9. 7.3.9 Safety Features
        1. 7.3.9.1 Power-Good Monitor
        2. 7.3.9.2 Redundant VOUT Monitor
        3. 7.3.9.3 Fault Output
        4. 7.3.9.4 Voltage Reference Monitor
        5. 7.3.9.5 Start-Up Diagnostics
        6. 7.3.9.6 Overcurrent and Short-Circuit Protection
        7. 7.3.9.7 Hiccup
        8. 7.3.9.8 Thermal Shutdown
        9. 7.3.9.9 Redundant Temperature Sensor
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Peak Current Mode Operation
        2. 7.4.2.2 Auto Mode Operation
          1. 7.4.2.2.1 Diode Emulation
        3. 7.4.2.3 FPWM Mode Operation
        4. 7.4.2.4 Dropout
        5. 7.4.2.5 Recovery from Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Choosing the Switching Frequency
        3. 8.2.2.3 FB for Adjustable or Fixed Output Voltage Mode
        4. 8.2.2.4 Inductor Selection
        5. 8.2.2.5 Output Capacitor Selection
        6. 8.2.2.6 Input Capacitor Selection
        7. 8.2.2.7 CBOOT
        8. 8.2.2.8 External UVLO
        9. 8.2.2.9 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.1 Absolute Maximum Ratings

Over the operating junction temperature range –40°C to +150°C (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage VIN to PGND –0.3 45 V
Input voltage EN/UVLO TO PGND –0.3 45 V
Input voltage RT to PGND –0.3 45 V
Input voltage VSNS to PGND –0.3 40 V
Input voltage BIAS TO PGND –0.3 40 V
Input voltage MODE/CLKIN/TEMP to PGND –0.3 5.5 V
Input voltage FB to PGND –0.3 5.5 V
Output voltage SW to PGND –0.6 VIN  V
Output voltage SW to PGND less than 10ns transient  –5.0 VIN V
Output voltage nFAULT to PGND –0.3 40 V
Output voltage PGOOD to PGND –0.3 40 V
Output voltage BST to SW –0.3 5.5 V
Output voltage VCC to PGND –0.3 5.5 V
Temperature Operating junction temperature TJ –40 150 °C
Temperature Storage temperature Tstg –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.