SNVU874A December   2024  – April 2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Connector, Jumper, DIP switch and Test point Description
      1. 2.1.1 Connector Descriptions
      2. 2.1.2 Jumper Descriptions
      3. 2.1.3 DIP Switch Descriptions
      4. 2.1.4 Test Points Description
      5. 2.1.5 Easy to Use Features
  9. 3Implementation Results
    1. 3.1 Test Setup and Procedure
      1. 3.1.1 Test Setup
      2. 3.1.2 Test Procedure
      3. 3.1.3 Precautions
    2. 3.2 Performance Data and Results
      1. 3.2.1 Efficiency
      2. 3.2.2 Steady State Waveforms
      3. 3.2.3 Step Load Response
      4. 3.2.4 AC Loop Response Curve
      5. 3.2.5 Thermal Performance
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layers
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1.     Trademarks
  12. 6Revision History

PCB Layers

LM5125EVM-BST  Top Silk Screen Figure 4-2 Top Silk Screen
LM5125EVM-BST  Bottom Silk Screen Figure 4-3 Bottom Silk Screen
LM5125EVM-BST  Top Layer Figure 4-4 Top Layer
LM5125EVM-BST  Signal Layer 1 Figure 4-5 Signal Layer 1
LM5125EVM-BST  Signal Layer 2 Figure 4-6 Signal Layer 2
LM5125EVM-BST  Signal Layer 3 Figure 4-7 Signal Layer 3
LM5125EVM-BST  Signal Layer 4 Figure 4-8 Signal Layer 4
LM5125EVM-BST  Bottom Layer Figure 4-9 Bottom Layer