SNVU930 November   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Connector, Jumper, DIP switch and Test point Description
      1. 2.1.1 Connector Descriptions
      2. 2.1.2 Jumper Descriptions
      3. 2.1.3 DIP Switch Descriptions
      4. 2.1.4 Test Points Description
  9. 3Easy to Use Features
  10. 4Implementation Results
    1. 4.1 Test Setup and Procedure
      1. 4.1.1 Test Setup
      2. 4.1.2 Test Setup for Stacking 2 EVMs
      3. 4.1.3 Test Procedure
      4. 4.1.4 Precautions
  11. 5Application Curves
    1. 5.1 Efficiency
    2. 5.2 Steady State Waveforms
    3. 5.3 Step Load Response
    4. 5.4 AC Loop Response Curve
    5. 5.5 Thermal Performance
  12. 6Hardware Design Files
    1. 6.1 Schematic
    2. 6.2 PCB Layers
    3. 6.3 Bill of Materials
  13. 7Additional Information
    1.     Trademarks

PCB Layers

LM5126AEVM-BST Top Silk ScreenFigure 6-2 Top Silk Screen
LM5126AEVM-BST Bottom Silk ScreenFigure 6-3 Bottom Silk Screen
LM5126AEVM-BST Top LayerFigure 6-4 Top Layer
LM5126AEVM-BST Signal Layer 1Figure 6-5 Signal Layer 1
LM5126AEVM-BST Signal Layer 2Figure 6-6 Signal Layer 2
LM5126AEVM-BST Signal Layer 3Figure 6-7 Signal Layer 3
LM5126AEVM-BST Signal Layer 4Figure 6-8 Signal Layer 4
LM5126AEVM-BST Bottom LayerFigure 6-9 Bottom Layer