SPRAD85 March   2023 AM62A3 , AM62A3-Q1 , AM62A7 , AM62A7-Q1

 

  1.   Abstract
  2.   Trademarks
  3. 1 Introduction
    1. 1.1 Before Getting Started
    2. 1.2 Device (Processor) Selection
    3. 1.3 Technical Documentation
    4. 1.4 Design Documentation
  4. 2 System Block Diagram
    1. 2.1 Creating the System Block Diagram
    2. 2.2 Selecting the Boot Mode
    3. 2.3 Confirming Pin Multiplexing Compatibility
  5. 3 Power Supply
    1. 3.1 Power Supply Architecture
      1. 3.1.1 Integrated Power Architecture
      2. 3.1.2 Discrete Power Architecture
    2. 3.2 Power (Supply) Rails
      1. 3.2.1 Core Supply
      2. 3.2.2 Peripheral Power Supply
      3. 3.2.3 Internal LDOs for I/O groups
      4. 3.2.4 Dual-Voltage LVCMOS I/Os
      5. 3.2.5 Dual-Voltage Dynamic Switching I/Os for SDIO
      6. 3.2.6 VPP (eFuse ROM programming supply)
    3. 3.3 Determining System Power Requirements
    4. 3.4 Power Supply Filters
    5. 3.5 Power Supply Decoupling and Bulk Capacitors
      1. 3.5.1 Note on PDN target impedance
    6. 3.6 Power Supply Sequencing
    7. 3.7 Supply Diagnostics
    8. 3.8 Power Supply Monitoring
  6. 4 Clocking
    1. 4.1 System Clock Inputs
    2. 4.2 Unused Clock Inputs
    3. 4.3 Clock Output
    4. 4.4 Single-Ended Clock Sources
    5. 4.5 Crystal Selection
  7. 5 JTAG
    1. 5.1 JTAG / Emulation
      1. 5.1.1 Configuration of JTAG / Emulation
      2. 5.1.2 System Implementation of JTAG / Emulation
      3. 5.1.3 JTAG Termination
  8. 6 Device Configurations and Initialization
    1. 6.1 Device Reset
    2. 6.2 Latching of the Boot Modes
    3. 6.3 Watchdog Timer
  9. 7 Peripherals
    1. 7.1  Selecting Peripherals Across Functional Domains
    2. 7.2  Memory
      1. 7.2.1 Processor DDR Subsystem and Device Register Configuration
    3. 7.3  Media and Data Storage Interfaces
    4. 7.4  Ethernet Interface Using CPSW3G Common Platform Switch 3-port Gigabit Ethernet
    5. 7.5  Programmable Real-Time Unit Subsystem (PRUSS)
    6. 7.6  Universal Serial Bus (USB) Subsystem
    7. 7.7  General Connectivity
    8. 7.8  Display Subsystem (DSS)
    9. 7.9  Camera Subsystem (CSI)
    10. 7.10 Termination of Unused Peripherals and I/Os
      1. 7.10.1 EXTINTn
  10. 8 I/O Buffers and Termination
  11. 9 Power Consumption and Thermal Solutions
    1. 9.1 Power Consumption
    2. 9.2 Power Savings Modes
    3. 9.3 Guidance on Thermal Solution
  12. 10Schematics Recommendations
    1. 10.1 Selection of Component and Component Values
    2. 10.2 Schematics Development
    3. 10.3 Reviewing the Schematics
    4. 10.4 Floor Planning of the PCB
  13. 11Layout and Routing Guidelines
    1. 11.1 Escape Routing Guidelines
    2. 11.2 LPDDR4 Board Design and Layout Guidelines
    3. 11.3 High-Speed Differential Signal Routing Guidance
  14. 12Device Handling and Assembly
  15. 13References
  16. 14Acronyms Used in This Document

1 Introduction

The Hardware Design Guide for AM62A7/AM62A3 family of Devices Application Report provides a starting point for the engineers designing with AM62A7/AM62A3 processors. It provides an overview of the flow, design efforts and highlights important areas that must be addressed. Note that this document does not contain all of the information needed to complete the board design. In many cases, it refers to the device-specific data manual or to various other user's guides as sources for specific information.

The document is organized in a sequential manner. It starts from decisions that must be made during the initial planning stages of the design, through the selection of key devices, electrical, and thermal requirements. For ensuring design success, issues discussed in each of the section should be resolved before moving to the next section.

Note: This guide may not cover every aspect of the board design.
Note: The AM62A7/AM62A3 device has capabilities to help board designers address safety requirements. This guide is focused on non-safety applications.