SPRADK4 October 2024 AM263P2-Q1 , AM263P4 , AM263P4-Q1
OptiFlash technology, which is TI’s differentiated memory technology, enables high performance and low-cost solution by right mix of on-chip SRAM and external flash. An SoC with integrated OptiFlash technology, as shown in Figure 2-1, aims to solve the limitations faced by traditional high-performance MCUs with external flash, by providing hybrid execution from internal SRAM and directly from external flash (also known as Execute in Place (XIP)), with a goal of reaching XIP performance from external flash to that of internal SRAM. The major cost advantage of this solution is that the internal SRAM can now be sized lower than the application image size, and the silicon die-cost without embedded flash/NVM is much cheaper due to reduced number of masks and cheaper equipment. This solution also provides scalability in terms of the size (in the order of MBytes) and parts on board based on customer need.

Executing from external Flash brings a host of challenges that needs to be solved such as: Performance, Functional Safety, Security, Startup-time and Firmware upgrade. OptiFlash solution integrated in an MCU/SoC chip, as shown in Figure 3-1, provides a set of innovative Hardware (HW) Accelerators and Software (SW) tooling, that aims to solve all the above challenges when executing from external Flash. OptiFlash can address up to 128MB of external flash while enabling the lowest possible system BOM cost.