SPRSPC3 February   2026 AM13E23019

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1.      Device Package Options
      2. 5.1.1 AM13E230x Pin Diagrams
    2. 5.2 Pin Attributes
      1. 5.2.1 Pin Attributes Header List
      2.      13
    3. 5.3 Signal Descriptions
      1.      15
      2.      16
      3.      17
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      6.      20
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      31.      45
      32.      46
      33.      47
      34.      48
      35.      49
      36.      50
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings – Commercial
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 Digital IO
    6. 6.6 Analog Peripherals
      1. 6.6.1 Analog-to-Digital Converter (ADC)
      2. 6.6.2 ADC Characteristics
        1. 6.6.2.1 ADC Operating Conditions
        2. 6.6.2.2 ADC Electrical Data and Timing
        3. 6.6.2.3 External ADC Start-of-Conversion Switching Characteristics
      3. 6.6.3 Comparator Subsystem (CMPSS)
      4. 6.6.4 CMPSS Electrical Data and Timing
        1. 6.6.4.1 CMPSS_LITE Comparator Electrical Characteristics
        2. 6.6.4.2 CMPSS_LITE DAC Static Electrical Characteristics
      5. 6.6.5 Programmable Gain Amplifier (PGA)
      6. 6.6.6 PGA Electrical Data and Timing
        1. 6.6.6.1 PGA Operating Conditions
        2. 6.6.6.2 PGA Characteristics
      7. 6.6.7 Temperature Sensor Characteristics
      8.      Internal Analog Connections
    7. 6.7 Control Peripherals
      1. 6.7.1 Multichannel Pulse Width Modulator (MCPWM)
      2. 6.7.2 Control Peripherals Synchronization
      3. 6.7.3 MCPWM Electrical Data and Timing
        1. 6.7.3.1 MCPWM Timing Requirements
        2. 6.7.3.2 MCPWM Switching Characteristics
      4. 6.7.4 Enhanced Capture eCAP
      5. 6.7.5 eCAP Block Diagram
      6. 6.7.6 eCAP Synchronization
      7. 6.7.7 eCAP Electrical Data and Timing
        1. 6.7.7.1 eCAP Timing Requirements
        2. 6.7.7.2 eCAP Switching Characteristics
      8. 6.7.8 Enhanced Quadrature Encoder Pulse (eQEP)
      9. 6.7.9 eQEP Electrical Data and Timing
        1. 6.7.9.1 eQEP Timing Requirements
        2. 6.7.9.2 eQEP Switching Characteristics
    8. 6.8 Communication Peripherals
      1. 6.8.1 Modular Controller Area Network (MCAN)
  8. 7 Detailed Description
    1. 7.1  Description
      1. 7.1.1 Functional Block Diagram
    2. 7.2  Memory
      1. 7.2.1 Peripheral Registers Memory Map
      2. 7.2.2 Static RAM
      3. 7.2.3 Flash Memory
    3. 7.3  Identification
    4. 7.4  Arm Cortex-M33 CPU
      1. 7.4.1 Trigonometric Math Unit (TMU)
      2. 7.4.2 Debug Subsystem
    5. 7.5  TinyEngineTM Neural-network Processing Unit (NPU)
    6. 7.6  DMA
    7. 7.7  Error Aggregator Module (EAM)
    8. 7.8  Power Management and Clock Unit (PMCU)
      1. 7.8.1 Power Management Unit (PMU)
      2. 7.8.2 Operating Modes
        1. 7.8.2.1 Functionality by Operating Mode
      3. 7.8.3 Clock Module (CKM)
    9. 7.9  UNICOMM (UART/I2C/SPI)
      1. 7.9.1 Universal Asychronous Receiver/Transmitter (UART)
      2. 7.9.2 Inter-Integrated Circuit (I2C)
      3. 7.9.3 Serial Peripheral Interface (SPI)
    10. 7.10 CAN-FD
    11. 7.11 Serial Wire Debug Interface
    12. 7.12 External Peripheral Interface (EPI)
    13. 7.13 Bootstrap Loader (BSL)
    14. 7.14 Security
      1. 7.14.1 Global Security Controller
      2. 7.14.2 AESADV
      3. 7.14.3 Keystore Controller
    15. 7.15 Timers (TIMx)
    16. 7.16 WWDT
  9. 8 Applications, Implementation, and Layout
    1. 8.1 External Oscillator
    2. 8.2 JTAG and TRACE
    3. 8.3 Application and Implementation
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Device Nomenclature
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Device Comparison

Table 4-1 lists the features of the AM13E230x microcontrollers.

Table 4-1 Device Comparison
Feature AM13E23019 AM13E23018 AM13E23017
PROCESSOR AND ACCELERATORS
Arm® Cortex®-M33 CPU Core Frequency 200MHz
Custom Datapath Extension (CDE) Yes
Memory Protection Unit (MPU) Yes
Micro Trace Buffer (MTB) Yes
Trigonometric Math Unit (TMU) Yes
TinyEngineTM Neural-network Processing Unit (NPU) Yes
MEMORY
Flash - with Error Correction Code (ECC) 512KB 256KB 128KB
SRAM - with HW Parity 128KB 128KB 64KB
Security Features JTAGLOCK, Secure Boot
Cyclic Redundancy Check (CRC) CRC-16/CRC-32
SYSTEM
Data Movement Architecture (DMA) Controller 1x12-Channel
16-bit General-Purpose Timer (TIMG12) 1
32-bit General-Purpose Timer (TIMG4) 1
Windowed Watchdog Timer (WWDT) 1
Internal 4MHz/32MHz Oscillator (SYSOSC) 1
Phase-Locked Loop up to 200MHz (SYSPLL) 1
Internal 32kHz Oscillator (LFOSC) 1
Crystal Oscillator (HFXT)/External Clock (HFCLK) input 1
Internal 3.3V to 1.35V LDO Yes
General Purpose Input/Output (GPIO) Up to 107 (package-dependent)
ANALOG PERIPHERALS
Analog to Digital Converter (ADC) ADCs 3
Bits 12-bit ADC
ADC channels Up to 32 channels
Temperature Sensor 1
Programmable Gain Amplifier (PGA) with Analog Input Mux 3
Comparator Subsystem (CMPSS) CMPSS (each includes 2x 11-bit DAC + 2x digital filters) 4
DACL Buffered Output 2
CONTROL PERIPHERALS
Motor-control Pulse Width Modulation (MCPWM) 5 (6-ch)
Enhanced Capture Module (eCAP) 2
Enhanced Quadrature Encoder Pulse Module (eQEP) 3
COMMUNICATION PERIPHERALS
UNICOMM SPGSS0 UART Up to 3 (2 UART, 1 UART+LIN)
I2C Up to 3 (2 I2C, 1 I2C+SMBUS)
SPI Up to 2
SPGSS1 UART Up to 3 (2 UART, 1 UART+LIN)
I2C Up to 3 (2 I2C, 1 I2C+SMBUS)
SPI Up to 2
Modular Controller Area Network (MCAN) 1x (CAN/CAN-FD)
HIGH SPEED PERIPHERALS
External Peripheral Interface (EPI) 1
PACKAGE, TEMPERATURE, AND QUALIFICATION OPTIONS
Junction temperature (TJ) –40°C to 125°C
Ambient Temperature (TA) –40°C to 105°C