SPVA024 June   2025 ADC810-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  POR
    6. 5.6  Timing Characteristics
    7. 5.7  Analog/Digital IO
      1. 5.7.1  Electrical Characteristics
      2. 5.7.2 Switching Characteristics
    8. 5.8  ADC
      1. 5.8.1 Electrical Characteristics
      2. 5.8.2 Linearity Parameters
      3. 5.8.3 Switching Characteristics
    9. 5.9  VREF
      1. 5.9.1 Electrical Characteristics
      2. 5.9.2 Voltage Characteristics
    10. 5.10 I2C
      1. 5.10.1 I2C Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Multiplexer
      2. 6.3.2 Voltage Reference
      3. 6.3.3 Oscillator
      4. 6.3.4 Output Data Rate and Conversion Time
      5. 6.3.5 Digital Comparator
      6. 6.3.6 Conversion Ready Pin
      7. 6.3.7 Interrupt Output (INT)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Reset and Power-Up
      2. 6.4.2 Operating Modes
        1. 6.4.2.1 Single-Shot Mode
        2. 6.4.2.2 Continuous-Conversion Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
        1. 6.5.1.1 I2C Address Selection
        2. 6.5.1.2 I2C General Call
        3. 6.5.1.3 I2C Speed Modes
      2. 6.5.2 Target Mode Operations
        1. 6.5.2.1 Receive Mode
        2. 6.5.2.2 Transmit Mode
      3. 6.5.3 Writing To and Reading From the Registers
      4. 6.5.4 Data Format
  8. 7 Register Map
  9. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Schematic
      2. 8.1.2 ADC Configuration Examples
      3. 8.1.3 GPIO Configuration Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Documentation Support
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.7.1  Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH High level input voltage I2CIO(1) VDD≥1.62V 0.7*VDD 5.5 V
I2CIO(1) VDD≥2.7V 2 5.5 V
All I/O except I2CIO VDD≥1.62V 0.7*VDD VDD+0.3 V
VIL Low level input voltage I2CIO VDD≥1.62V -0.3 0.3*VDD V
I2CIO VDD≥2.7V -0.3 0.8 V
All I/O except I2CIO VDD≥1.62V -0.3 0.3*VDD V
VHYS Hysteresis I2CIO 0.05*VDD V
All I/O except I2CIO 0.1*VDD V
Ilkg High-Z leakage current SDIO(2)(3) VDD = 3V 50 nA
CI Input capacitance VDD = 3.3V 5 pF
VOH High level output voltage SDIO VDD≥2.7V, |IIO|,max=6mA VDD-0.5 V
VOH High level output voltage SDIO VDD ≥ 1.71V, |IIO|,max=2mA VDD-0.4 V
VOL Low level output voltage SDIO VDD≥2.7V, |IIO|,max=6mA
VDD≥1.71V, |IIO|,max=2mA		 0.4 V
VOL Low level output voltage
I2CIO		 VDD≥2.7V, IOL,max=8mA
VDD≥1.71V, IOL,max=4mA		 0.5 V
(1) I/O Types: I2CIO= I2C 5V Tolerant Open-Drain , SDIO = Standard-Drive (Includes ADD pins)
(2) The leakage current is measured with VSS or VDD applied to the corresponding pin(s), unless otherwise noted.
(3) The leakage of the Analog/Digital pins is measured individually. The port pin is selected for input, and the pullup/pulldown resistor is disabled.