SPVA065 June   2026 TIC12400-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2On-Chip ADC Front-End Architecture Overview
  6. 3Understanding the ILKG Specification in the Datasheet
    1. 3.1 Interpretation of the ±110 µA Specification
    2. 3.2 The Leakage Current Is MUX-Activated and Time-Limited
  7. 4Design Considerations with Weak Voltage Sources
    1. 4.1 Definition of a Weak Voltage Source
    2. 4.2 Mechanism of the Sampling Spike
  8. 5Quantitative Model and Error Estimation
    1. 5.1 Voltage Step During the Sampling Window
    2. 5.2 Steady-State Offset with High-Impedance Sources
  9. 6Design Mitigation Methods
    1. 6.1 Method 1: Strengthen the Voltage Source
    2. 6.2 Method 2: External RC Compensation (Recommended)
    3. 6.3 Method 3: Static Offset Calibration
  10. 7Summary
  11. 8References

3.1 Interpretation of the ±110 µA Specification

The ±110µA ILKG specification is a worst-case bound that covers the full range of operating conditions, supply voltages, temperatures, and internal device states across all production units. The ± sign indicates that the current can flow in either direction—into or out of the INx pin—depending on the internal node voltages at the time the MUX connects the channel. This value is intended to bound the maximum transient current that the external source can be required to supply or absorb and should not be interpreted as a typical or continuous operating current.