SWRS152O June   2013  – January 2026 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Functional Block Diagram
6. 5 Device Comparison
   1. 5.1 Related Products
7. 6 Pin Configuration and Functions
   1. 6.1 Pin Attributes
8. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  External Digital Slow Clock Requirements
   5. 7.5  Thermal Resistance Characteristics for MOC 100-Pin Package
   6. 7.6  WLAN Performance: 2.4GHz Receiver Characteristics
   7. 7.7  WLAN Performance: 2.4GHz Transmitter Power
   8. 7.8  WLAN Performance: Currents
   9. 7.9  Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
   10. 7.10 Bluetooth Performance: Transmitter, BR
   11. 7.11 Bluetooth Performance: Transmitter, EDR
   12. 7.12 Bluetooth Performance: Modulation, BR
   13. 7.13 Bluetooth Performance: Modulation, EDR
   14. 7.14 Bluetooth Low Energy Performance: Receiver Characteristics – In-Band Signals
   15. 7.15 Bluetooth Low Energy Performance: Transmitter Characteristics
   16. 7.16 Bluetooth Low Energy Performance: Modulation Characteristics
   17. 7.17 Bluetooth BR and EDR Dynamic Currents
   18. 7.18 Bluetooth Low Energy Currents
   19. 7.19 Timing and Switching Characteristics
       1. 7.19.1 Power Management
          1. 7.19.1.1 Block Diagram – Internal DC-DCs
       2. 7.19.2 Power-Up and SHUTDOWN States
       3. 7.19.3 Chip Top-level Power-Up Sequence
       4. 7.19.4 WLAN Power-Up Sequence
       5. 7.19.5 Bluetooth-Bluetooth Low Energy Power-Up Sequence
       6. 7.19.6 WLAN SDIO Transport Layer
          1. 7.19.6.1 SDIO Timing Specifications
          2. 7.19.6.2 SDIO Switching Characteristics – High Rate
       7. 7.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
          1. 7.19.7.1 UART 4-Wire Interface – H4
       8. 7.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications
9. 8 Detailed Description
   1. 8.1 WLAN Features
   2. 8.2 Bluetooth Features
   3. 8.3 Bluetooth Low Energy Features
   4. 8.4 Device Certification
      1. 8.4.1 FCC Certification and Statement
      2. 8.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 8.4.3 ETSI/CE
      4. 8.4.4 MIC Certification
   5. 8.5 Module Markings
   6. 8.6 Test Grades
   7. 8.7 End Product Labeling
   8. 8.8 Manual Information to the End User
10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
       1. 9.1.1 Typical Application – WL1835MODGB Reference Design
       2. 9.1.2 Design Recommendations
       3. 9.1.3 RF Trace and Antenna Layout Recommendations
       4. 9.1.4 Module Layout Recommendations
       5. 9.1.5 Thermal Board Recommendations
       6. 9.1.6 Baking and SMT Recommendations
          1. 9.1.6.1 Baking Recommendations
          2. 9.1.6.2 SMT Recommendations
11. 10Device and Documentation Support
    1. 10.1 Device Support
       1. 10.1.1 Third-Party Products Disclaimer
       2. 10.1.2 Development Support
          1. 10.1.2.1 Tools and Software
       3. 10.1.3 Device Support Nomenclature
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
       1. 12.2.1 Tape and Reel Specification
       2. 12.2.2 Packing Specification
          1. 12.2.2.1 Reel Box
          2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
       1. 12.3.1 PACKAGE OPTION ADDENDUM