SWRS301 September   2026 CC1407P

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Power Consumption (Power Modes)
    5. 6.5  Power Consumption (Radio Modes)
    6. 6.6  RF Frequency Bands
    7. 6.7  Reset Timing
    8. 6.8  Temperature Sensor
    9. 6.9  Battery Monitor
    10. 6.10 GPIO DC Characteristics
    11. 6.11 SPI Characteristics
    12. 6.12 DC/DC
    13. 6.13 48MHz Crystal Oscillator (HFXT)
    14. 6.14 48MHz Clock Output Buffer
    15. 6.15 48MHz Clock Input (TCXO)
    16. 6.16 32kHz RC Oscillator (LFOSC)
    17. 6.17 782MHz - 957MHz Receive (RX)
    18. 6.18 782 MHz - 957 MHz Transmit (TX)
    19. 6.19 RF PLL Phase Noise and Spurious
  8. 7 Detailed Description
    1. 7.1 Radio (RF Core)
    2. 7.2 Memory
    3. 7.3 Battery and Temperature Monitor
    4. 7.4 Proprietary Radio Form
    5. 7.5 Power Management
  9. 8 Application, Implementation, and Layout
    1. 8.1 Reference Designs
      1. 8.1.1 Highest Performance
      2. 8.1.2 Long Range low external Bill of Material
      3. 8.1.3 Antenna Kit for LaunchPad
    2. 8.2 Junction Temperature Calculation
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Tools and Software
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Documentation Support
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Export Control Notice
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

8.1 Reference Designs

The following reference designs should be followed closely when implementing designs using the CC1407P device.

Special attention must be paid to RF component placement, decoupling capacitors, and DCDC regulator components, as well as ground connections for all of these. For optimum RF performance, especially when using the high-power PA, it is important to accurately follow the reference design with respect to component values and layout. Failure to do so may lead to reduced RF performance due to balun mismatch. The amplitude and phase balance through the balun must be <1 dB and <6 degrees, respectively. PCB stack-up is also critical for proper operation. The C140xP EVMs and characterization boards are using a finished thickness between the top layer (RF signals) and layer 2 (ground plane) of 175 µm.

The CC1407P has a very flexible RF front-end design that enables many different optimzations. To enable customers to quickly evaluate the different options we have created different reference designs.

Integrated balun devices can be used, the following balun is recommended for CC1407P high-power PA output:

  • Murata LFB21892MBGGF964