SWRS301 September   2026 CC1407P

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Power Consumption (Power Modes)
    5. 6.5  Power Consumption (Radio Modes)
    6. 6.6  RF Frequency Bands
    7. 6.7  Reset Timing
    8. 6.8  Temperature Sensor
    9. 6.9  Battery Monitor
    10. 6.10 GPIO DC Characteristics
    11. 6.11 SPI Characteristics
    12. 6.12 DC/DC
    13. 6.13 48MHz Crystal Oscillator (HFXT)
    14. 6.14 48MHz Clock Output Buffer
    15. 6.15 48MHz Clock Input (TCXO)
    16. 6.16 32kHz RC Oscillator (LFOSC)
    17. 6.17 782MHz - 957MHz Receive (RX)
    18. 6.18 782 MHz - 957 MHz Transmit (TX)
    19. 6.19 RF PLL Phase Noise and Spurious
  8. 7 Detailed Description
    1. 7.1 Radio (RF Core)
    2. 7.2 Memory
    3. 7.3 Battery and Temperature Monitor
    4. 7.4 Proprietary Radio Form
    5. 7.5 Power Management
  9. 8 Application, Implementation, and Layout
    1. 8.1 Reference Designs
      1. 8.1.1 Highest Performance
      2. 8.1.2 Long Range low external Bill of Material
      3. 8.1.3 Antenna Kit for LaunchPad
    2. 8.2 Junction Temperature Calculation
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Tools and Software
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Documentation Support
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Export Control Notice
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

9.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or date-codes. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, XCC1407P is in preview; therefore, an X prefix/identification is assigned).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Production devices have been characterized fully, and the quality and reliability of the devices have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate is still undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGZ).

For orderable part numbers of CC1407P devices in the RKP (5mm × 5mm) package type, see the Package Option Addendum of this document, the Device Information in Section 3, the TI website (www.ti.com), or contact your TI sales representative.