SWRS325A December   2024  – December 2025 AWRL6844

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Functional Block Diagram
  6. Device Comparison
    1. 5.1 Related Products
  7. Terminal Configurations and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
      1.      11
      2.      12
      3.      13
      4.      14
      5.      15
      6.      16
      7.      17
      8.      18
      9.      19
      10.      20
      11.      21
      12.      22
      13.      23
      14.      24
      15.      25
      16.      26
      17.      27
      18.      28
    3.     29
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
      1. 7.6.1 3.3V I/O Topology
      2. 7.6.2 1.8V I/O Topology
      3. 7.6.3 System Topologies
        1. 7.6.3.1 I/O Topologies
      4. 7.6.4 RF Supply Decoupling Capacitor and Layout Conditions
        1. 7.6.4.1 1.2V RF Supply Rail
          1. 7.6.4.1.1 1.2V RF Rail
        2. 7.6.4.2 1.0V RF LDO
          1. 7.6.4.2.1 1.0V RF LDO
      5. 7.6.5 Noise and Ripple Specifications
    7. 7.7  Power Save Modes
      1. 7.7.1 Typical Power Consumption Numbers
    8. 7.8  Peak Current Requirement per Voltage Rail
    9. 7.9  RF Specification
    10. 7.10 Supported DFE Features
    11. 7.11 CPU Specifications
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 Timing and Switching Characteristics
      1. 7.13.1  Power Supply Sequencing and Reset Timing
      2. 7.13.2  Synchronized Frame Triggering
      3. 7.13.3  Input Clocks and Oscillators
        1. 7.13.3.1 Clock Specifications
      4. 7.13.4  MultiChannel buffered / Standard Serial Peripheral Interface (McSPI)
        1. 7.13.4.1 McSPI Features
        2. 7.13.4.2 SPI Timing Conditions
        3. 7.13.4.3 SPI—Controller Mode
          1. 7.13.4.3.1 Timing and Switching Requirements for SPI - Controller Mode
          2. 7.13.4.3.2 Timing and Switching Characteristics for SPI Output Timings—Controller Mode
        4. 7.13.4.4 SPI—Peripheral Mode
          1. 7.13.4.4.1 Timing and Switching Requirements for SPI - Peripheral Mode
          2. 7.13.4.4.2 Timing and Switching Characteristics for SPI Output Timings—Secondary Mode
      5. 7.13.5  LVDS Instrumentation and Measurement Peripheral
        1. 7.13.5.1 LVDS Interface Configuration
        2. 7.13.5.2 LVDS Interface Timings
      6. 7.13.6  LIN
      7. 7.13.7  General-Purpose Input/Output
        1. 7.13.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 7.13.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.13.8.1 Dynamic Characteristics for the CANx TX and RX Pins
      9. 7.13.9  Serial Communication Interface (SCI)
        1. 7.13.9.1 SCI Timing Requirements
      10. 7.13.10 Inter-Integrated Circuit Interface (I2C)
        1. 7.13.10.1 I2C Timing Requirements
      11. 7.13.11 Quad Serial Peripheral Interface (QSPI)
        1. 7.13.11.1 QSPI Timing Conditions
        2. 7.13.11.2 Timing Requirements for QSPI Input (Read) Timings
        3. 7.13.11.3 QSPI Switching Characteristics
      12. 7.13.12 JTAG Interface
        1. 7.13.12.1 JTAG Timing Conditions
        2. 7.13.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.13.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1  RF and Analog Subsystem
      2. 8.3.2  Clock Subsystem
      3. 8.3.3  Transmit Subsystem
      4. 8.3.4  Receive Subsystem
      5. 8.3.5  Processor Subsystem
      6. 8.3.6  Automotive Interface
      7. 8.3.7  Host Interface
      8. 8.3.8  Application Subsystem Cortex-R5F
      9. 8.3.9  DSP Subsystem
      10. 8.3.10 Hardware Accelerator (HWA1.2) Features
        1. 8.3.10.1 Hardware Accelerator Feature Differences Between HWA1.1 in xWRx843, HWA1.2 in xWRLx432 and HWA1.2 in xWRL684x
    4. 8.4 Other Subsystems
      1. 8.4.1 Security – Hardware Security Module
      2. 8.4.2 GPADC Channels (Service) for User Application
      3. 8.4.3 GPADC Parameters
    5. 8.5 Memory Partitioning Options
    6. 8.6 Boot Modes
  10. Monitoring and Diagnostics
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Device Comparison

The following table compares the features of radar devices.

Table 5-1 Device Features Comparison
FUNCTION

AWRL6844

AWRL6843

AWR6843

AWR6843AOP

AWRL6432

Antenna on Package (AOP) - - - Yes -
Number of receivers 4 4 4 4 3
Number of transmitters 4 3 3 3 2
RF frequency range 57 to 64GHz 57 to 64GHz 60 to 64GHz 60 to 64GHz 57 to 64GHz
On-chip memory 2.5MB 2MB 1.75MB 1.75MB 1MB
Max I/F (Intermediate Frequency) (MHz) 10 10 10 10 5
Max real sampling rate (Msps) 25 25 25 25 12.5
Max Complex Sampling rate (Msps) - - 12.5 12.5 -
Low Power Deep Sleep Mode Yes Yes - - Yes
Safety and Security
Functional Safety -Compliance ASIL-B Targeted(1) ASIL-B Targeted(1) ASIL-B ASIL-B ASIL-B
Cybersecurity - Compliance CAL2 targeted CAL2 targeted - - -
Device Security(2) Yes (Secure Boot supported) Yes (Secure Boot supported) Yes (Secure Boot supported) Yes (Secure Boot supported) Yes (Authenticated Boot supported)
Hardware Security Module (HSM) Yes Yes - - -
Processors
MCU R5F® R5F® R4F® R4F® M4F®
DSP C66x C66x C674x C674x -
HWA HWA 1.2 HWA 1.2 HWA1.1 HWA1.1 HWA 1.2
Peripherals
Serial Peripheral Interface (SPI) ports 2 2 2 2 2
Quad Serial Peripheral Interface (QSPI) Yes Yes Yes Yes Yes
Inter-Integrated Circuit (I2C) interface 1 1 1 1 1
Controller Area Network (CAN-FD) interface 2 2 2 2 1
DSP Trace - - Yes Yes -
PWM Yes Yes Yes Yes Yes
Hardware In Loop (HIL/DMM) - - Yes Yes -
GPADC 4 4 6 6 2
ADC Raw Data Capture LVDS LVDS LVDS LVDS RDIF
LIN Yes Yes - - Yes
UART 3(3) 3(3) 2 2 2
JTAG Yes Yes Yes Yes Yes
Per Chirp configurable TX phase shifter BPM Only BPM Only Yes(4) Yes(4) BPM Only
Product status Product Preview (PP), Advance Information (AI), or Production Data (PD) PD(5) PD(5) PD(5) PD(5) PD(5)
As the certification can get secured at different times and post certificate the target will be updated to “compliant” from “compliance targeted” only in related data sheets, please refer to the respective data sheets for most recent compliance status.
Device security features including Secure Boot and Customer Programmable Keys are available in select devices for only select part variants as indicated by the Device Type identifier in Section 3, Device Information table.
3 UART instances are available, including 2 UART instance from APPSS and 1 UART instace from DSS
6 bits linear Phase Shifter.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty.