SWRU637 March   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Temperature Range
    3. 2.3 Energy Trace
    4. 2.4 Hardware and Debug Setup
      1. 2.4.1 Using a LaunchPad XDS110 Debug Probe
      2. 2.4.2 Using a Generic XDS110 Debug Probe, Including a Separate LaunchPad
    5. 2.5 BoosterPack Connector Pinout
    6. 2.6 XDS110 Interface Connector
    7. 2.7 Debug Interface Connector
    8. 2.8 Jumper Information
    9. 2.9 Push Buttons
  9. 3Advanced use of the LaunchPad Hardware
    1. 3.1 External Antenna
    2. 3.2 XDS110 GPIOs
    3. 3.3 Reset Selection on BoosterPack Connector
    4. 3.4 I2C Pullup Resistors
  10. 4Software
    1. 4.1 Getting Started
    2. 4.2 Out of Box Demo
  11. 5Hardware Design Files
    1. 5.1 Reference Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  12. 6Compliance Information
    1. 6.1 CE Compliance
    2. 6.2 REACH Compliance
    3. 6.3 Waste Electrical and Electronic Equipment (WEEE) Compliance
  13. 7Additional Information
    1. 7.1 Trademarks
  14. 8References

5.3 Bill of Materials (BOM)

Table 5-1 shows the simplified Bill of Materials (BOM) for the LP-EM-CC2340R53. The full LP-EM-CC2340R53 BOM can be downloaded from LP-EM-CC2340R53 design files.

Table 5-1 LP-EM-CC2340R53 Bill-of-Materials
QuantityDesignatorValueManufacturerPart NumberDescription
1B10KOA SPEERRK73Z1JTTDRESISTOR, THICK FILM, 0, 0R/+0.05R, 1A, -55oC/+155oC, 0603
1C91uFMURATAGRM155Z71A105KE01DCAPACITOR, CERAMIC X7R, 1uF, 10V, -10%/+10%, -55oC/+125oC, 0402
2C33, C341.5pFMURATAGRM0335C1H1R5BA01JCAPACITOR, CERAMIC C0G/NP0, 1.5pF, 50V, -0.1pF/+0.1pF, -55oC/+125oC, 0201
8C55, C92, C99, C101, C102, C103, C106, C1070.1uFMURATAGRM033C71A104KE14DCAPACITOR, CERAMIC X7S, 0.1μF, 10V, -10%/+10%, -55oC/+125oC, 0201
1C8112pFMURATAGRM0335C1H120GA01DCAPACITOR, CERAMIC C0G/NP0, 12pF, 50V, -2%/+2%, -55oC/+125oC, 0201
2C91, CA215pFMURATAGRM0335C1H150GA01DCAPACITOR, CERAMIC C0G/NP0, 15pF, 50V, -2%/+2%, -55oC/+125oC, 0201
2C104, C10510uFMURATAGRM188Z71A106KA73DCAPACITOR, CERAMIC X7R, 10uF, 10V, -10%/+10%, -55oC/+125oC, 0603, SMD
1CR1LPL296-J2L2-25OSRAMLP L296-J2L2-25OPTO, LED, InGaAlP, GREEN, 560nm, 2V, 0.02A, 0603
1CR2LS L296-P2Q2-1OSRAMLS L296-P2Q2-1OPTO, LED, RED, 630nm, 2V, 0.02A, 0603
2CR8, CR9TPD6E004RSETEXAS INSTRUMENTSTPD6E004RSERDIODE, PROTECTION, ESD ARRAY - 6 CHANNELS, 0.9V TO 5.5V, VBR:7V, -40oC/+85oC, QFN8
1CR10TPD1E0B04DPYTEXAS INSTRUMENTSTPD1E0B04DPYRDIODE, PROTECTION, TVS, BID, 6.7V, 15W, -40oC/+125oC, X1SON2
2J1, J2SSQ-110-23-L-DSAMTECSSQ-110-23-L-DCONNECTOR, HEADER, FEMALE, STRAIGHT, 2 ROWS, 20 PINS, 2.54mm, PTH
1J7SMA-10V21-TGGHUS-TSANSMA-10V21-TGGCONNECTOR, COAX, RF, FEMALE, STRAIGHT, 1 PIN
1L110uHMURATALQM18DN100M70LINDUCTOR, STANDARD, CHIP, FERRITE CORE, 10uH, -20%/+20%, 0.1A, -55oC/+125oC, 0603
1L332.8nHMURATALQP03TN2N8B02JINDUCTOR, RF, CHIP, NON-MAGNETIC CORE, 2.8nH, -0.1nH/+0.1nH, 0.5A, -55oC/+125oC, 0201
2P1, P5BB02-HC031-KB1-603000GRADCONNBB02-HC031-KB1-603000CONNECTOR, HEADER, MALE, STRAIGHT, 1 ROW, 3 PINS, PITCH 2.54mm, PTH
1P2BB02-HJ041-KB1-603000GRADCONNBB02-HJ041-KB1-603000CONNECTOR, HEADER, MALE, STRAIGHT, 2 ROWS, 4 PINS, PITCH 2.54mm, PTH
1P3SFH11-PBPC-D10-RA-BKSULLINSSFH11-PBPC-D10-RA-BKCONNECTOR, HEADER, FEMALE, RIGHT ANGLE, 2 ROW(S), 20 PINS, PITCH 2.54mm, PTH
1P4FTSH-105-01-F-DV-KSAMTECFTSH-105-01-F-DV-KCONNECTOR, HEADER, MALE, STRAIGHT, 2 ROWS, 10 PINS, PITCH 1.27mm
1R1100kVISHAYCRCW0201100KJNEDRESISTOR, THICK FILM, 100k, -5%/+5%, 0.05W, 30V, -55oC/+155oC, 0201
4R4, R5, R25, R510VISHAYCRCW06030000Z0ECRESISTOR, THICK FILM, 0, 0R/+0.02R, 0.1W, 2A, -55oC/+155oC, 0603
1R14180VISHAYCRCW0402180RJNEDRESISTOR, THICK FILM, 180, -5%/+5%, 0.063W, 50V, -55oC/+155oC, 0402
1R15220VISHAYCRCW0402220RJNEDRESISTOR, THICK FILM, 220, -5%/+5%, 0.063W, 50V, -55°C/+155oC, 0402
1R242.2kVISHAYCRCW04022K20JNEDRESISTOR, THICK FILM, 2.2k, -5%/+5%, 0.063W, 50V, -55oC/+155oC, 0402
2R55, R56100VISHAYCRCW0402100RJNEDRESISTOR, THICK FILM, 100, -5%/+5%, 0.063W, 50V, -55oC/+155oC, 0402
2SW1, SW21188E-1K2DIPTRONICS1188E-1K2-V-TRSWITCH, TACT, 0.05A@12VDC, 0.05A@250VAC
1U1CC2340R53E0RKPTEXAS INSTRUMENTSCC2340R53E0RKPRIC, MICROCONTROLLER, CC2340R5, 32-bit, SIMPLELINK WIRELESS MCU ARM CORTEX -M0+, 512kbyte FLASH, 1.71V TO 3.8V, VQFN40-EP
1U3MX25R8035FZUIL0MACRONIXMX25R8035FZUIL0IC, MEMORY, FLASH, OTHER, 8Mbit, 8M X 1bit / 4M X 2bit / 2M X 4bit, 12ns, 1.65V TO 3.6V, uSON8
1U4CAT24C08TDIONSEMICAT24C08TDI-GT3IC, MEMORY, ROM, EEPROM, SERIAL, I2C, 8kbit, 1k X 8bit, 900ns, 1.7V TO 5.5V, TSOT23-5
1Y132.768KHzTAI-SAWTZ3359DAAO73CRYSTAL, RESONATOR, 32.768KHz, -380PPM/+380PPM, -40oC/+125oC
1Y248MHzTAI-SAWTZ3908AAAO43CRYSTAL, RESONATOR, 48MHz, -30PPM/+30PPM, -40DEGC/+125DEGC
1Z601.2pFMURATAGRM0335C1H1R2BA01JCAPACITOR, CERAMIC C0G/NP0, 1.2pF, 50V, -0.1pF/+0.1pF, -55oC/+125oC, 0201
1Z612nHMURATALQP03TN2N0B02JINDUCTOR, RF, CHIP, NON-MAGNETIC CORE, 2nH, -0.1nH/+0.1nH, 0.6A, -55oC/+125oC, 0201
1Z620.7pFMURATAGRM0335C1HR70BA01JCAPACITOR, CERAMIC C0G/NP0, 0.7pF, 50V, -0.1pF/+0.1pF, -55oC/+125oC, 0201