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Product details

Parameters

Technology Family AC VCC (Min) (V) 3 VCC (Max) (V) 5.5 Channels (#) 8 IOL (Max) (mA) 24 ICC (Max) (uA) 80 IOH (Max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns), Input clamp diode Data rate (Mbps) 120 Rating Catalog open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

SOIC (DW) 24 160 mm² 15.5 x 10.3 SSOP (DB) 24 64 mm² 8.2 x 7.8 TSSOP (PW) 24 34 mm² 4.4 x 7.8 open-in-new Find other Non-Inverting buffer/driver

Features

  • EPICTM (Enhanced-Performance Implanted CMOS ) 1-um Process
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic DIPs (NT)
  • EPIC is a trademark of Texas Instruments Incorporated.

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Description

The 74AC11244 is an octal buffer or line driver designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The device can be used as two 4-bit buffers or one 8-bit buffer, with active-low output-enable (OE\) inputs.

When OE\ is low, the device passes noninverted data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The 74AC11244 is characterized for operation from -40°C to 85°C.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 14
Type Title Date
* Datasheet Octal Buffer/Driver With 3-State Outputs datasheet (Rev. B) Sep. 15, 1998
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
More literature HiRel Unitrode Power Management Brochure Jul. 07, 2009
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Designing With Logic (Rev. C) Jun. 01, 1997
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc Apr. 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODEL Download
SCAM071.ZIP (7 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
SOIC (DW) 24 View options
SSOP (DB) 24 View options
TSSOP (PW) 24 View options

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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