CD4072B

ACTIVE

CMOS Dual 4-Input OR Gate

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Product details

Parameters

Technology Family CD4000 VCC (Min) (V) 3 VCC (Max) (V) 18 Channels (#) 2 Inputs per channel 4 IOL (Max) (mA) 6.8 IOH (Max) (mA) -6.8 Input type Standard CMOS Output type Push-Pull Features Standard Speed (tpd > 50ns) Data rate (Max) (Mbps) 8 Rating Catalog Operating temperature range (C) -55 to 125 open-in-new Find other OR gate

Package | Pins | Size

PDIP (N) 14 181 mm² 19.3 x 9.4 SOIC (D) 14 52 mm² 8.65 x 6 SOP (NS) 14 80 mm² 10.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4 open-in-new Find other OR gate

Features

  • Medium-Speed Operation - tPLH, tPHL = 60 ns (typ.) at VDD = 10 V
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Standardized, symmetrical output characteristics
  • Noise margin (full package-temperature range):
         1 V at VDD = 5 V
         2 V at VDD = 10 V
      2.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor

open-in-new Find other OR gate

Description

CD4071B, CD4072B and CD4075B OR gates provide the system designer with direct implementation of the positive-logic OR function and supplement the existing family of CMOS gates.

The CD4071B, CD4072B, and CD4075B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes) and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

open-in-new Find other OR gate
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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 9
Type Title Date
* Datasheet CD4071B, CD4072B, CD4075B TYPES datasheet (Rev. D) Aug. 21, 2003
Technical articles How to keep your motor running safely Jun. 04, 2020
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics Dec. 03, 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODEL Download
SCHM014.ZIP (7 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
PDIP (N) 14 View options
SO (NS) 14 View options
SOIC (D) 14 View options
TSSOP (PW) 14 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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