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CD74HC4016

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12-V, 1:1 (SPST), 4-channel analog switch

Data sheet
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12-V, 1:1 (SPST), 4-channel analog switch

CD74HC4016

ACTIVE
Data sheet Order now

Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5, 12 Ron (Typ) (Ohms) 30 Bandwidth (MHz) 200 Operating temperature range (C) -55 to 125 Features Break-before-make Input/output continuous current (Max) (mA) 25 Rating Catalog CON (Typ) (pF) 5 Supply current (Typ) (uA) 2 open-in-new Find other Analog switches & muxes

Package | Pins | Size

PDIP (N) 14 181 mm² 19.3 x 9.4 SOIC (D) 14 52 mm² 8.65 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4 open-in-new Find other Analog switches & muxes

Features

  • Wide Analog-Input-Voltage Range . . . 0V to 10V
  • Low "ON" Resistance
    • 45 (Typ) . . . . VCC = 4.5V
    • 35 (Typ) . . . . VCC = 6V
    • 30 (Typ) . .1fcVCC = 9V
  • Fast Switching and Propagation Delay Times
  • Low "OFF" Leakage Current
  • Built-In "Break-Before-Make" Switching
  • Suitable for Sample and Hold Applications
  • Wide Operating Temperature Range . . . -55°C to 125°C
  • HC Types
    • 2V to 10V Operation
    • High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
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Description

The CD74HC4016 contains four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits.

Each switch has two input/output terminals (nY, nZ) and an active high enable input (nE). Current through the switch will not cause additional VCC current provided the analog voltage is maintained between VCC and GND.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 17
Type Title Date
* Datasheet CD74HC4016 datasheet (Rev. C) Aug. 02, 2004
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Designing With Logic (Rev. C) Jun. 01, 1997
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions May 01, 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc Apr. 01, 1996

Design & development

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Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


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CAD/CAE symbols

Package Pins Download
PDIP (N) 14 View options
SOIC (D) 14 View options
TSSOP (PW) 14 View options

Ordering & quality

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