Dual channel general purpose, low voltage, low power, rail-to-rail output operational amplifiers<
Product details
Parameters
Package | Pins | Size
Features
- Specified 2.7-V and 5-V Performance
- No Crossover Distortion
- Space-Saving Package
- 5-Pin SC70 2 × 2.1 × 1 mm
- Industrial Temperature Range: –40°C to 85°C
- Gain-Bandwidth Product: 152 kHz
- Low Supply Current
- LPV321-N: 9 µA
- LPV358-N: 15 µA
- LPV324-N: 28 µA
- Rail-to-Rail Output Swing at 100 kΩ :
- V+ – 3.5 mV
- V– + 90 mV
- VCM, –0.2 V to V+ – 0.8 V
Description
The LPV3xx-N are low power (9-µA per channel at 5 V) versions of the LMV3xx op amps. This is another addition to the LMV family of commodity op amps.
The LPV3xx-N are the most cost effective solutions for the applications where low voltage, low power operation, space saving and low price are needed. The LPV3xx-N have rail-to-rail output swing capability and the input common-mode voltage range includes ground. They all exhibit excellent speed-power ratio, achieving 152 kHz of bandwidth with a supply current of only 9 µA.
The LPV321-N is available in space saving 5-Pin SC70, which is approximately half the size of 5-Pin SOT-23. The small package saves space on PC boards, and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.
The chips are built with Texas Instruments's advanced submicron silicon-gate BiCMOS process. The LPV3xx-N have bipolar input and output stages for improved noise performance and higher output current drive.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | LPV321-N Single, LPV358-N Dual, and LPV324-N Quad General-Purpose, Low Voltage, Low Power, Rail-to-Rail Output Operational Amplifiers datasheet (Rev. E) | Nov. 18, 2016 |
| Technical articles | What is an op amp? | Jan. 21, 2020 | |
| Technical articles | How to lay out a PCB for high-performance, low-side current-sensing designs | Feb. 06, 2018 | |
| Technical articles | Low-side current sensing for high-performance cost-sensitive applications | Jan. 22, 2018 | |
| Technical articles | Voltage and current sensing in HEV/EV applications | Nov. 22, 2017 | |
| E-book | The Signal e-book: A compendium of blog posts on op amp design topics | Mar. 28, 2017 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
Features
- 10 circuit configurations to choose from: Non-Inverting, Inverting, Active Filters, Difference Amplifier with Reference Buffer, and more!
- Multiple interface options: SMA, Header, Breadboard, Wire
- Designed for 0805 size components; 0603 size friendly
- Circuit schematic provided in silkscreen on the back (...)
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Features
- Expedites circuit design with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs)
- Noise calculations
- Common unit translation
- Solves common amplifier circuit design problems
- Gain selections using standard resistors
- Filter configurations
- Total noise for common amplifier configurations
- (...)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| SOIC (D) | 8 | View options |
| VSSOP (DGK) | 8 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
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