SN74ACT241

ACTIVE

Octal Buffers/Drivers With 3-State Outputs

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Product details

Parameters

Technology Family ACT VCC (Min) (V) 4.5 VCC (Max) (V) 5.5 Channels (#) 8 IOL (Max) (mA) 24 ICC (Max) (uA) 40 IOH (Max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns), Input clamp diode Data rate (Mbps) 180 Rating Catalog open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 TSSOP (PW) 20 42 mm² 6.5 x 6.4 open-in-new Find other Non-Inverting buffer/driver

Features

  • 4.5-V to 5.5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 8.5 ns at 5 V
  • Inputs Are TTL Compatible

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Description

These octal buffers and line drivers are designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The ’ACT241 devices are organized as two 4-bit buffers/drivers with separate complementary output-enable (1(OE)\ and 2OE) inputs. When 1(OE)\ is low or 2OE is high, the device passes noninverted data from the A inputs to the Y outputs. When 1(OE)\ is high or 2OE is low, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, (OE)\ should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking or the current-sourcing capability of the driver.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SN54ACT241, SN74ACT241 datasheet (Rev. C) Oct. 07, 2002
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application notes Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application notes CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application notes Designing With Logic (Rev. C) Jun. 01, 1997
Application notes Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc Apr. 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODELS Download
SCAM123.ZIP (7 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options
TSSOP (PW) 20 View options

Ordering & quality

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