SN74F541

ACTIVE

Octal Buffers/Drivers With 3-State Outputs

Top

Product details

Parameters

Technology Family F VCC (Min) (V) 4.5 VCC (Max) (V) 5.5 Channels (#) 8 IOL (Max) (mA) 64 ICC (Max) (uA) 75000 IOH (Max) (mA) -15 Input type Bipolar Output type 3-State Features Very high speed (tpd 5-10ns), Over-voltage tolerant inputs Data rate (Mbps) 140 Rating Catalog open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 open-in-new Find other Non-Inverting buffer/driver

Features

  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Data Flow-Through Pinout (All Inputs on Opposite Side From Outputs)
  • Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
open-in-new Find other Non-Inverting buffer/driver

Description

The ´F541 octal buffer/line driver is ideal for driving bus lines or buffering memory address registers. The device features inputs and outputs on opposite sides of the package to facilitate printed-circuit-board layout.

The 3-state control gate is a 2-input AND gate with active-low inputs so that if either output enable ( or ) input is high, all eight outputs are in the high-impedance state.

The SN54F541 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F251 is characterized for operation from 0°C to 70°C.

 

 

open-in-new Find other Non-Inverting buffer/driver
Download

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 10
Type Title Date
* Datasheet Octal Buffers/Drivers With 3-State Outputs datasheet (Rev. A) Oct. 01, 1993
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application notes Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application notes Designing With Logic (Rev. C) Jun. 01, 1997
Application notes Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODELS Download
SDFM011A.ZIP (6 KB) - IBIS Model
SIMULATION MODELS Download
SDFM028.ZIP (2 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options

Ordering & quality

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos

Related videos