Home Logic & voltage translation Buffers, drivers & transceiver Noninverting buffers & drivers
Home
Logic & voltage translation
Buffers, drivers & transceiver
Noninverting buffers & drivers

SN74LVC125A

ACTIVE

4-ch, 1.65-V to 3.6-V buffers with 3-state outputs

Order now
Data sheet

SN74LVC125A

ACTIVE
Data sheet Order now

Product details

Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 4 IOL (max) (mA) 24 Supply current (max) (µA) 40 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 4 IOL (max) (mA) 24 Supply current (max) (µA) 40 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
SOIC (D) 14 51.9 mm² 8.65 x 6 SOP (NS) 14 79.56 mm² 10.2 x 7.8 SSOP (DB) 14 48.36 mm² 6.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4 VQFN (RGY) 14 12.25 mm² 3.5 x 3.5
  • 3-State Outputs
  • Separate OE for all 4 buffers
  • Operates From 1.65 V to 3.6 V
  • Specified From –40°C to 85°C
    and –40°C to 125°C
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.8 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Latch-Up Performance Exceeds 250 mA
    Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 200-V Machine Model
    • 1000-V Charged-Device Model
  • APPLICATIONS
    • Cable Modem Termination Systems
    • IP Phones: Wired and Wireless
    • Optical Modules
    • Optical Networking:
      • EPON or Video Over Fiber
    • Point-to-Point Microwave Backhaul
    • Power: Telecom DC/DC Modules:
      • Analog or Digital
    • Private Branch Exchanges (PBX)
    • TETRA Base Stations
    • Telecom Base Band Units
    • Telecom Shelters:
      • Filter Units
      • Power Distribution Units (PDU)
      • Power Monitoring Units (PMU)
      • Wireless Battery Monitoring
      • Remote Electrical Tilt Units (RET)
      • Remote Radio Units (RRU)
      • Tower Mounted Amplifiers (TMA)
    • Vector Signal Analyzers and Generators
    • Video Conferencing: IP-Based HD
    • WiMAX and Wireless Infrastructure Equipment
    • Wireless Communications Testers
    • xDSL Modems and DSLAM

All other trademarks are the property of their respective owners
  • 3-State Outputs
  • Separate OE for all 4 buffers
  • Operates From 1.65 V to 3.6 V
  • Specified From –40°C to 85°C
    and –40°C to 125°C
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.8 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Latch-Up Performance Exceeds 250 mA
    Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 200-V Machine Model
    • 1000-V Charged-Device Model
  • APPLICATIONS
    • Cable Modem Termination Systems
    • IP Phones: Wired and Wireless
    • Optical Modules
    • Optical Networking:
      • EPON or Video Over Fiber
    • Point-to-Point Microwave Backhaul
    • Power: Telecom DC/DC Modules:
      • Analog or Digital
    • Private Branch Exchanges (PBX)
    • TETRA Base Stations
    • Telecom Base Band Units
    • Telecom Shelters:
      • Filter Units
      • Power Distribution Units (PDU)
      • Power Monitoring Units (PMU)
      • Wireless Battery Monitoring
      • Remote Electrical Tilt Units (RET)
      • Remote Radio Units (RRU)
      • Tower Mounted Amplifiers (TMA)
    • Vector Signal Analyzers and Generators
    • Video Conferencing: IP-Based HD
    • WiMAX and Wireless Infrastructure Equipment
    • Wireless Communications Testers
    • xDSL Modems and DSLAM

All other trademarks are the property of their respective owners

This quadruple bus buffer gate is designed for 1.65-V to 3.6-V VCC operation.

The SN74LVC125A device features independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is high.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.

This quadruple bus buffer gate is designed for 1.65-V to 3.6-V VCC operation.

The SN74LVC125A device features independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is high.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.
open-in-new Find other Noninverting buffers & drivers
Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare products
Drop-in replacement with upgraded functionality to the compared device.
SN74AHC125 ACTIVE 4-ch, 2-V to 5.5-V buffers with 3-state outputs

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 28
Type Title Date
* Data sheet SN74LVC125A Quadruple Bus Buffer Gate With 3-State Outputs datasheet (Rev. Q) PDF | HTML 25 Jan 2015
More literature Optimizing Board Space for Discrete LOGIC Designs Using Smallest Package Solutio (Rev. A) PDF | HTML 29 Sep 2022
More literature Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
More literature How to Select Little Logic (Rev. A) 26 Jul 2016
More literature Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
More literature Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
More literature Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
More literature Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
More literature Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
More literature Texas Instruments Little Logic Application Report 01 Nov 2002
More literature TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
More literature 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
More literature Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
More literature Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
More literature Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
More literature CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
More literature LVC Characterization Information 01 Dec 1996
More literature Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
More literature Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Generic Logic EVM Supporting 14 through 24 Pin PW, DB, D, DW, NS, DYY, and DGV Packages

This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, DYY or DGV package in a 14 to 24 pin count.

User guide: PDF | HTML
Not available on TI.com
Evaluation board

14-24-NL-LOGIC-EVM — Generic 14 through 24 pin non-leaded package evaluation module

Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.
User guide: PDF | HTML
Not available on TI.com
Simulation model

HSPICE Model for SN74LVC125A

SCEJ248.ZIP (97 KB) - HSpice Model
Download
Simulation model

SN74LVC125A Behavioral SPICE Model

SCAM111.ZIP (7 KB) - PSpice Model
Download
Simulation model

SN74LVC125A IBIS Model (Rev. C)

SCEM013C.ZIP (45 KB) - IBIS Model
Download
Simulation model

SN74LVC125A PSpice Transient Model

SCAM059.ZIP (30 KB) - PSpice Model
Download
Simulation model

SN74LVC125A TINA-TI Transient Reference Design

SCAM060.ZIP (44 KB) - TINA-TI Reference Design
Download
Simulation model

SN74LVC125A TINA-TI Transient Spice Model

SCAM061.ZIP (9 KB) - TINA-TI Spice Model
Download
Reference designs

TIDA-00189 — Isolated Loop Powered Thermocouple Transmitter Reference Design

The Isolated Loop powered Thermocouple Transmitter reference design is a system solution providing precision K-type thermocouple measurements for 4 to 20-mA isolated current-loop applications. This design is intended as an evaluation module for users to fast prototype and develop end-products for (...)
Design guide: PDF
Schematic: PDF
Package Pins Download
SOIC (D) 14 View options
SOP (NS) 14 View options
SSOP (DB) 14 View options
TSSOP (PW) 14 View options
VQFN (RGY) 14 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos