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Product details

Parameters

Technology Family LVC VCC (Min) (V) 1.65 VCC (Max) (V) 3.6 Bits (#) 8 Voltage (Nom) (V) 1.8, 2.5, 2.7, 3.3 F @ nom voltage (Max) (MHz) 100 ICC @ nom voltage (Max) (mA) 0.03 Propagation delay (Max) (ns) 12.7, 8.3, 7.3, 6.3 IOL (Max) (mA) 24 IOH (Max) (mA) -24 Rating Catalog Operating temperature range (C) -40 to 125 open-in-new Find other Standard transceiver

Package | Pins | Size

PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 TSSOP (PW) 20 42 mm² 6.5 x 6.4 TVSOP (DGV) 20 32 mm² 5 x 6.4 VQFN (RGY) 20 16 mm² 3.5 x 4.5 open-in-new Find other Standard transceiver

Features

  • Operates From 1.65 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 6.3 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down
    Mode and Back Drive protection
  • Supports Mixed-Mode Signal Operation on All
    Ports (5-V Input/Output Voltage With 3.3-V VCC)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
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Description

These octal bus transceivers are designed for 1.65-V to 3.6-V VCC operation. The ’LVC245A devices are designed for asynchronous communication between data buses.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SN74LVC245A Octal Bus Transceiver With 3-State Outputs datasheet (Rev. X) Jan. 25, 2015
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note LVC Characterization Information Dec. 01, 1996
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
User guide Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
EVALUATION BOARD Download
20
Description
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic and translation devices with included dual supply support
  • Board has 9 sections that can be broken apart for a smaller form factor

Design tools & simulation

SIMULATION MODEL Download
SCAM006D.ZIP (41 KB) - IBIS Model
SIMULATION MODEL Download
SCEJ191.ZIP (110 KB) - HSpice Model

Reference designs

REFERENCE DESIGNS Download
Current Sense Reference Design for High-Switching Transient Three-Phase Inverter for Servo Drives
TIDA-01455 — The TIDA-01455 is a reinforced isolated, in-line, shunt-based, precision-phase current sensing reference design for three-phase inverters. One of the challenges with GaN or SiC inverters at high PWM switching is accurate phase current sensing across the shunt in presence of noise due to the high PWM (...)
document-generic Schematic
REFERENCE DESIGNS Download
Cascade imaging radar capture reference design using Jacinto™ ADAS processor
TIDEP-01017 The cascade development kit has two main use cases:
  1. To use the MMWCAS-DSP-EVM as a capture card to fully evaluate the AWR2243 four-chip cascade performance by using the mmWave studio tool, please read the TIDEP-01012 design guide.
  2. To use the MMWCAS-DSP-EVM to develop radar real time SW application (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
BGA MICROSTAR JUNIOR (ZQN) 20 View options
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options
TSSOP (PW) 20 View options
TVSOP (DGV) 20 View options
VQFN (RGY) 20 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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