Octal Bus Transceiver With 3-State Outputs
Product details
Parameters
Package | Pins | Size
Features
- Operates From 1.65 V to 3.6 V
- Inputs Accept Voltages to 5.5 V
- Max tpd of 6.3 ns at 3.3 V
- Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
> 2 V at VCC = 3.3 V, TA = 25°C - Ioff Supports Live Insertion, Partial-Power-Down
Mode and Back Drive protection - Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With 3.3-V VCC) - Latch-Up Performance Exceeds 250 mA Per JESD 17
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model
- 1000-V Charged-Device Model
Description
These octal bus transceivers are designed for 1.65-V to 3.6-V VCC operation. The ’LVC245A devices are designed for asynchronous communication between data buses.
Technical documentation
= Top documentation for this product selected by TI
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
14-24-LOGIC-EVM
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
14-24-NL-LOGIC-EVM
Description
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic and translation devices with included dual supply support
- Board has 9 sections that can be broken apart for a smaller form factor
Design tools & simulation
SCAM006D.ZIP (41 KB) - IBIS Model
SCEJ191.ZIP (110 KB) - HSpice Model
Reference designs
TIDA-01455 — The TIDA-01455 is a reinforced isolated, in-line, shunt-based, precision-phase current sensing reference design for three-phase inverters. One of the challenges with GaN or SiC inverters at high PWM switching is accurate phase current sensing across the shunt in presence of noise due to the high PWM (...)
Design files
-
download TIDA-01455 BOM Files.zip (140KB) -
download TIDA-01455 Assembly Files.zip (434KB) -
download TIDA-01455 Layer Plots.zip (2999KB) -
download TIDA-01455 CAD Files.zip (7473KB) -
download TIDA-01455 Gerber.zip (859KB)
TIDEP-01017 — The cascade development kit has two main use cases:
- To use the MMWCAS-DSP-EVM as a capture card to fully evaluate the AWR2243 four-chip cascade performance by using the mmWave studio tool, please read the TIDEP-01012 design guide.
- To use the MMWCAS-DSP-EVM to develop radar real time SW application (...)
Design files
-
download TIDEP-01017 Assembly Drawing (Rev. A).pdf (2726KB) -
download TIDEP-01017 BOM (Rev. A).pdf (224KB) -
download TIDEP-01017 CAD Files (Rev. B).zip (11490KB) -
download TIDEP-01017 Gerber (Rev. B).zip (3095KB) -
download TIDEP-01017 PCB (Rev. B).pdf (41832KB) -
download PROC055A Cascade Radar Host Design Files.zip (19371KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
BGA MICROSTAR JUNIOR (ZQN) | 20 | View options |
PDIP (N) | 20 | View options |
SO (NS) | 20 | View options |
SOIC (DW) | 20 | View options |
SSOP (DB) | 20 | View options |
TSSOP (PW) | 20 | View options |
TVSOP (DGV) | 20 | View options |
VQFN (RGY) | 20 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
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