Product details
Parameters
Package | Pins | Size
Features
- Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs
- Dependable Texas Instruments Quality and Reliability
Description
These devices contain three independent 3-input NAND gates.
The SN5410, SN54LS10, and SN54S10 are characterized for operation over the full military temperature range of –55°C to 125°C. The SN7410, SN74LS10 and SN74S10 are characterized for operation from 0°C to 70°C.
Technical documentation
= Top documentation for this product selected by TI
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | SN5410, SN54LS10, SN54S10, SN7410, SN74LS10, SN74S10 datasheet (Rev. A) | Apr. 16, 2003 |
| Technical articles | How to keep your motor running safely | Jun. 04, 2020 | |
| Selection guide | Logic Guide (Rev. AB) | Jun. 12, 2017 | |
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | Dec. 02, 2015 | |
| User guide | LOGIC Pocket Data Book (Rev. B) | Jan. 16, 2007 | |
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 | |
| More literature | Logic Cross-Reference (Rev. A) | Oct. 07, 2003 | |
| Application note | Designing With Logic (Rev. C) | Jun. 01, 1997 | |
| Application note | Input and Output Characteristics of Digital Integrated Circuits | Oct. 01, 1996 | |
| Application note | Live Insertion | Oct. 01, 1996 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
14-24-LOGIC-EVM
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Design tools & simulation
SLDM018.ZIP (7 KB) - PSpice Model
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| PDIP (N) | 14 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.