6.5-V, 1:1 (SPST), 10-channel voltage clamp
Product details
Parameters
Package | Pins | Size
Features
- Designed to be Used in Voltage-Limiting Applications
- 6.5-
On-State Connection Between Ports A and B
- Flow-Through Pinout for Ease of Printed Circuit Board Trace Routing
- Direct Interface With GTL+ Levels
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 1000-V Charged-Device Model (C101)
Description
The SN74TVC3010 provides 11 parallel NMOS pass transistors with a common gate. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.
The device can be used as a 10-bit switch with the gates cascaded together to a reference transistor. The low-voltage side of each pass transistor is limited to a voltage set by the reference transistor. This is done to protect components with inputs that are sensitive to high-state voltage-level overshoots. (See Application Information in this data sheet.)
All of the transistors in the TVC array have the same electrical characteristics; therefore, any one of them can be used as the reference transistor. Since, within the device, the characteristics from transistor to transistor are equal, the maximum output high-state voltage (VOH) is approximately the reference voltage (VREF), with minimal deviation from one output to another. This is a large benefit of the TVC solution over discrete devices. Because the fabrication of the transistors is symmetrical, either port connection of each bit can be used as the low-voltage side, and the I/O signals are bidirectional through each FET.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | SN74TVC3010 datasheet (Rev. G) | Aug. 27, 2003 |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Selection guide | Logic Guide (Rev. AB) | Jun. 12, 2017 | |
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | Dec. 02, 2015 | |
User guide | LOGIC Pocket Data Book (Rev. B) | Jan. 16, 2007 | |
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 | |
Application note | Selecting the Right Level Translation Solution (Rev. A) | Jun. 22, 2004 | |
User guide | Signal Switch Data Book (Rev. A) | Nov. 14, 2003 | |
More literature | Logic Cross-Reference (Rev. A) | Oct. 07, 2003 | |
Application note | TI IBIS File Creation, Validation, and Distribution Processes | Aug. 29, 2002 | |
More literature | Standard Linear & Logic for PCs, Servers & Motherboards | Jun. 13, 2002 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOIC (DW) | 24 | View options |
SSOP (DBQ) | 24 | View options |
TSSOP (PW) | 24 | View options |
TVSOP (DGV) | 24 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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