SN74TVC3010

ACTIVE

6.5-V, 1:1 (SPST), 10-channel voltage clamp

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Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 11 Power supply voltage - single (V) 0.8, 1.2, 1.8, 2.5, 3.3, 5 Bandwidth (MHz) 100 Operating temperature range (C) -40 to 85 Input/output continuous current (Max) (mA) 64 Rating Catalog CON (Typ) (pF) 12 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (DW) 24 160 mm² 15.5 x 10.3 SSOP (DBQ) 24 52 mm² 8.65 x 6 TSSOP (PW) 24 34 mm² 4.4 x 7.8 TVSOP (DGV) 24 32 mm² 5 x 6.4 open-in-new Find other Analog switches & muxes

Features

  • Designed to be Used in Voltage-Limiting Applications
  • 6.5- On-State Connection Between Ports A and B
  • Flow-Through Pinout for Ease of Printed Circuit Board Trace Routing
  • Direct Interface With GTL+ Levels
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 1000-V Charged-Device Model (C101)

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Description

The SN74TVC3010 provides 11 parallel NMOS pass transistors with a common gate. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.

The device can be used as a 10-bit switch with the gates cascaded together to a reference transistor. The low-voltage side of each pass transistor is limited to a voltage set by the reference transistor. This is done to protect components with inputs that are sensitive to high-state voltage-level overshoots. (See Application Information in this data sheet.)

All of the transistors in the TVC array have the same electrical characteristics; therefore, any one of them can be used as the reference transistor. Since, within the device, the characteristics from transistor to transistor are equal, the maximum output high-state voltage (VOH) is approximately the reference voltage (VREF), with minimal deviation from one output to another. This is a large benefit of the TVC solution over discrete devices. Because the fabrication of the transistors is symmetrical, either port connection of each bit can be used as the low-voltage side, and the I/O signals are bidirectional through each FET.

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Technical documentation

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Type Title Date
* Datasheet SN74TVC3010 datasheet (Rev. G) Aug. 27, 2003
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODEL Download
SCEJ171.ZIP (91 KB) - HSpice Model

CAD/CAE symbols

Package Pins Download
SOIC (DW) 24 View options
SSOP (DBQ) 24 View options
TSSOP (PW) 24 View options
TVSOP (DGV) 24 View options

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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