The TLIN4029A-Q1 is a local interconnect network (LIN) physical layer transceiver with integrated wake-up and protection features, compliant with LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2 A and ISO 17987–4 standards. LIN is a single-wire bidirectional bus typically used for in-vehicle networks using data rates up to 20kbps. The TLIN4029A-Q1 is designed to support 12V LIN and 24V LIN applications with wider operating voltage and extended ±70V bus-fault protection.
The LIN receiver supports data rates up to 100kbps for faster in-line programming. The TLIN4029A-Q1 converts the data stream on the TXD input into a LIN bus signal using a current-limited wave-shaping driver which reduces electromagnetic emissions (EME). The receiver converts the data stream to logic level signals that are sent to the microprocessor through the open-drain RXD pin. Ultra-low current consumption is possible using the sleep mode which allows wake-up via LIN bus or EN pin.
The TLIN4029A-Q1 integrates a resistor for LIN responder node applications, ESD protection, and fault protection which allow for a reduced amount of external components in the applications. The device prevents back-feed current through LIN to the supply input in case of a ground shift or supply voltage disconnection. The TLIN4029A-Q1 also includes undervoltage detection, temperature shutdown protection, and loss-of-ground protection.
| Top documentation | Type | Title | Format options | Date |
|---|---|---|---|---|
| * | Data sheet | TLIN4029A-Q1 Automotive LIN Transceiver with Dominant State Timeout and Extended Fault Protection datasheet | Aug 7, 2025 | |
| Application brief | Automotive Smart Actuators | PDF | HTML | May 20, 2026 | |
| White paper | Design Considerations for 48V Automotive Body Motor Applications | PDF | HTML | Feb 17, 2026 |
For additional terms or required resources, click any title below to view the detail page where available.
This reference design demonstrates a 48V, 300W peak smart motor brushless direct current (BLDC) implementation. The discrete approach enables compact and flexible form factors with diameters as small as 55mm. The design maintains low power sleep modes of less than 100µA. The design leverages TI (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| VSON (DRB) | 8 | Ultra Librarian |
| SOIC (D) | 8 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.