TLV9002 2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems | TI.com

TLV9002
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2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems

 

Description

The TLV900x family includes single (TLV9001), dual (TLV9002), and quad-channel (TLV9004) low-voltage (1.8 V to 5.5 V) operational amplifiers (op amps) with rail-to-rail input and output swing capabilities. These op amps provide a cost-effective solution for space-constrained applications such as smoke detectors, wearable electronics, and small appliances where low-voltage operation and high capacitive-load drive are required. The capacitive-load drive of the TLV900x family is 500 pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads. These op amps are designed specifically for low-voltage operation (1.8 V to 5.5 V) with performance specifications similar to the TLV600x devices.

The robust design of the TLV900x family simplifies circuit design. The op amps feature unity-gain stability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdrive conditions.

The TLV900x devices include a shutdown mode (TLV9001S, TLV9002S and TLV9004S) that allow the amplifiers to switch off into standby mode with typical current consumption less than 1 µA.

Micro-size packages, such as SOT-553 and WSON, are offered for all channel variants (single, dual, and quad), along with industry-standard packages such as SOIC, MSOP, SOT-23, and TSSOP packages.

Features

  • Scalable CMOS amplifier for low-cost applications
  • Rail-to-rail input and output
  • Low input offset voltage: ±0.4 mV
  • Unity-gain bandwidth: 1 MHz
  • Low broadband noise: 27 nV/√Hz
  • Low input bias current: 5 pA
  • Low quiescent current: 60 µA/Ch
  • Unity-gain stable
  • Internal RFI and EMI filter
  • Operational at supply voltages as low as 1.8 V
  • Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
  • Extended temperature range: –40°C to 125°C

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Parametrics

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Part number Order Number of channels (#) Total supply voltage (Min) (+5V=5, +/-5V=10) Total supply voltage (Max) (+5V=5, +/-5V=10) GBW (Typ) (MHz) Slew rate (Typ) (V/us) Rail-to-rail Vos (offset voltage @ 25 C) (Max) (mV) Iq per channel (Typ) (mA) Vn at 1 kHz (Typ) (nV/rtHz) Rating Operating temperature range (C) Package Group Package size: mm2:W x L (PKG) Offset drift (Typ) (uV/C) Features Input bias current (Max) (pA) CMRR (Typ) (dB) Output current (Typ) (mA) Architecture
TLV9002 Order now 2     1.8     5.5     1     2     In
Out    
1.5     0.06     30     Catalog     -40 to 125     SOIC | 8
SOT-23-THIN | 8
TSSOP | 8
VSSOP | 10
VSSOP | 8
WSON | 8
X2QFN | 10    
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8SOT-23-THIN: 8 mm2: 2.8 x 2.9 (SOT-23-THIN | 8)
8TSSOP: 19 mm2: 6.4 x 3 (TSSOP | 8)
10VSSOP: 9 mm2: 3 x 3 (VSSOP | 10)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8)
8WSON: 4 mm2: 2 x 2 (WSON | 8)
10X2QFN: 3 mm2: 2 x 1.5 (X2QFN | 10)    
0.6     Cost Optimized
EMI Hardened
Shutdown
Small Size    
  90     40     CMOS    
OPA2313 Order now 2     1.8     5.5     1     0.5     In
Out    
2.5     0.05     25     Catalog     -40 to 125     SOIC | 8
SON | 8
VSSOP | 8    
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8SON: 9 mm2: 3 x 3 (SON | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8)    
2     EMI Hardened
Small Size    
10     80     15     CMOS    
TLV2313 Order now 2     1.8     5.5     1     0.5     In
Out    
3     0.065     26     Catalog     -40 to 125     SOIC | 8
VSSOP | 8    
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8)    
2     Cost Optimized
EMI Hardened    
  85     15     CMOS    
TLV2314 Order now 2     1.8     5.5     3     1.5     In
Out    
3     0.15     16     Catalog     -40 to 125     SOIC | 8
VSSOP | 8    
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8)    
2     Cost Optimized
EMI Hardened    
  96     20