Automotive, 11-uA/Channel, 160kHz, RR-Out Dual Op Amp
Product details
Parameters
Package | Pins | Size
Features
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
Range - Device HBM Classification Level 2
- Device CDM Classification Level C6
- Device Temperature Grade 1: –40°C to
- BiMOS Rail-to-Rail Output
- Input Bias Current: 1 pA
- High Wide Bandwidth 160 kHz
- High Slew Rate: 0.1 V/µs
- Supply Current: 7 µA (per channel)
- Input Noise Voltage: 89 nV/√Hz
- Supply Voltage Range: 2.7 V to 16 V
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Description
The TLV27L2-Q1 single-supply operational amplifiers provide rail-to-rail output capability. The TLV27L2-Q1 device takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range, while adding the rail-to-rail output swing feature. The TLV27L2-Q1 device also provides 160-kHz bandwidth from only 7 µA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8-V supplies down to ±1.35 V) two rechargeable cells.
The rail-to-rail outputs make the TLV27L2-Q1 device good upgrades for the TLC27Lx family of devices which offers more bandwidth at a lower quiescent current. The TLV27L2-Q1 offset voltage is equal to that of the TLC27LxA variant. Their cost effectiveness makes them a good alternative to the TLC225x and TLV225x families of devices, where offset and noise are not of premium importance.
The TLV27L2-Q1 device is available in the commercial temperature range to enable easy migration from the equivalent TLC27Lx.
The TLV27L2-Q1 device is available in an 8-pin SOIC (D) package.
For all available packages, see the orderable addendum at the end of the datasheet.Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TLV27L2-Q1 Automotive Micropower Rail-to-Rail Output Operational Amplifier datasheet (Rev. A) | Dec. 29, 2015 |
Technical articles | What is an op amp? | Jan. 21, 2020 | |
E-book | Analog Engineer’s Pocket Reference Guide Fifth Edition (Rev. C) | Nov. 30, 2018 | |
Technical articles | How to lay out a PCB for high-performance, low-side current-sensing designs | Feb. 06, 2018 | |
Technical articles | Low-side current sensing for high-performance cost-sensitive applications | Jan. 22, 2018 | |
Technical articles | Voltage and current sensing in HEV/EV applications | Nov. 22, 2017 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | Mar. 28, 2017 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
Features
- 10 circuit configurations to choose from: Non-Inverting, Inverting, Active Filters, Difference Amplifier with Reference Buffer, and more!
- Multiple interface options: SMA, Header, Breadboard, Wire
- Designed for 0805 size components; 0603 size friendly
- Circuit schematic provided in silkscreen on the back (...)
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Features
- Expedites circuit design with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs)
- Noise calculations
- Common unit translation
- Solves common amplifier circuit design problems
- Gain selections using standard resistors
- Filter configurations
- Total noise for common amplifier configurations
- (...)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOIC (D) | 8 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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