TLV9004-Q1

ACTIVE

Automotive-grade, quad, 5.5-V, 1-MHz, RRIO operational amplifier for cost-optimized applications

Product details

Number of channels 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out GBW (typ) (MHz) 1 Slew rate (typ) (V/µs) 2 Vos (offset voltage at 25°C) (max) (mV) 1.6 Iq per channel (typ) (mA) 0.06 Vn at 1 kHz (typ) (nV√Hz) 30 Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Offset drift (typ) (µV/°C) 0.6 Features Cost Optimized, EMI Hardened, Small Size CMRR (typ) (dB) 77 Iout (typ) (A) 0.04 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.1 Input common mode headroom (to positive supply) (typ) (V) 0.1 Output swing headroom (to negative supply) (typ) (V) 0.01 Output swing headroom (to positive supply) (typ) (V) -0.01
Number of channels 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out GBW (typ) (MHz) 1 Slew rate (typ) (V/µs) 2 Vos (offset voltage at 25°C) (max) (mV) 1.6 Iq per channel (typ) (mA) 0.06 Vn at 1 kHz (typ) (nV√Hz) 30 Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Offset drift (typ) (µV/°C) 0.6 Features Cost Optimized, EMI Hardened, Small Size CMRR (typ) (dB) 77 Iout (typ) (A) 0.04 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.1 Input common mode headroom (to positive supply) (typ) (V) 0.1 Output swing headroom (to negative supply) (typ) (V) 0.01 Output swing headroom (to positive supply) (typ) (V) -0.01
TSSOP (PW) 14 32 mm² (5 mm × 6.4 mm) SOT-23-THN (DYY) 14 13.692 mm² (4.2 mm × 3.26 mm) SOIC (D) 14 51.9 mm² (8.65 mm × 6 mm)
  • AEC-Q100 qualified for automotive applications
    • Temperature grade 1: –40°C to +125°C, TA
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C6
  • Scalable CMOS amplifier for low-cost applications
  • Rail-to-rail input and output
  • Low input offset voltage: ±0.4mV
  • Unity-gain bandwidth: 1MHz
  • Low broadband noise: 27nV/√ Hz
  • Low input bias current: 5pA
  • Low quiescent current: 60µA\/Ch
  • Unity-gain stable
  • Internal RFI and EMI filter
  • Operational at supply voltages as low as 1.8V
  • Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
  • Functional Safety-Capable
  • AEC-Q100 qualified for automotive applications
    • Temperature grade 1: –40°C to +125°C, TA
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C6
  • Scalable CMOS amplifier for low-cost applications
  • Rail-to-rail input and output
  • Low input offset voltage: ±0.4mV
  • Unity-gain bandwidth: 1MHz
  • Low broadband noise: 27nV/√ Hz
  • Low input bias current: 5pA
  • Low quiescent current: 60µA\/Ch
  • Unity-gain stable
  • Internal RFI and EMI filter
  • Operational at supply voltages as low as 1.8V
  • Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
  • Functional Safety-Capable

The TLV900x-Q1 family includes single (TLV9001-Q1), dual (TLV9002-Q1), and quad-channel (TLV9004-Q1) low-voltage (1.8V to 5.5V) operational amplifiers (op amps) with rail-to-rail input and output swing capabilities. These op amps provide a cost-effective option for space-constrained automotive applications such as infotainment and lighting where low-voltage operation and high capacitive-load drive are required. The capacitive-load drive of the TLV900x-Q1 family is 500pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads. These op amps are designed specifically for low-voltage operation (1.8V to 5.5V) with performance specifications similar to the TLV600x-Q1 devices.

The robust design of the TLV900x-Q1 family simplifies circuit design. The op amps feature unity-gain stability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdrive conditions.

The TLV900x-Q1 family includes single (TLV9001-Q1), dual (TLV9002-Q1), and quad-channel (TLV9004-Q1) low-voltage (1.8V to 5.5V) operational amplifiers (op amps) with rail-to-rail input and output swing capabilities. These op amps provide a cost-effective option for space-constrained automotive applications such as infotainment and lighting where low-voltage operation and high capacitive-load drive are required. The capacitive-load drive of the TLV900x-Q1 family is 500pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads. These op amps are designed specifically for low-voltage operation (1.8V to 5.5V) with performance specifications similar to the TLV600x-Q1 devices.

The robust design of the TLV900x-Q1 family simplifies circuit design. The op amps feature unity-gain stability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdrive conditions.

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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet TLV900x-Q1 Low-Power RRIO 1MHz Automotive Operational Amplifier datasheet (Rev. G) PDF | HTML Apr 14, 2026
Functional safety information TLV900x-Q1 Functional Safety FIT Rate, FMD, and Pin FMA PDF | HTML Mar 4, 2021

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Evaluation board

AMP-PDK-EVM — Amplifier performance development kit evaluation module

The amplifier performance development kit (PDK) is an evaluation module (EVM) kit to test common operational amplifier (op amp) parameters and is compatible with most op amps and comparators. The EVM kit offers a main board with several socketed daughtercard options to fit package needs, allowing (...)

User guide: PDF | HTML
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Evaluation board

DYY-AMP-EVM — Evaluation module for operational amplifiers in the DYY package

The DYY-AMP-EVM is an evaluation module (EVM) to test the performance of the op amps available in DYY-14 (SOT-23 THN) packages. This EVM can easily be configured as an inverting amplifier, non-inverting amplifier and difference amplifier, which allows engineers to quickly evaluate and verify design (...)

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Simulation model

TLV9002 PSpice Model (Rev. D)

SBOMAL2D.ZIP (22 KB) - PSpice model
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Simulation model

TLV9002 TINA-TI Reference Design (Rev. A)

SBOMAL3B (43 KB) - TINA-TI reference design
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Simulation model

TLV9002 TINA-TI SPICE Model (Rev. B)

SBOMAH7C (5 KB) - TINA-TI Spice model
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Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 14 Ultra Librarian
SOT-23-THN (DYY) 14 Ultra Librarian
SOIC (D) 14 Ultra Librarian

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