12-V, 1:1 (SPST), 4-channel general-purpose analog switch (2 active low, 2 active high)
Product details
Parameters
We are not able to display this information. Please refer to the product data sheet.Package | Pins | Size
Features
- 2-V to 12-V Single-Supply Operation
- Specified ON-State Resistance:
- 15-Ω Maximum With 12-V Supply
- 20-Ω Maximum With 5-V Supply
- 50-Ω Maximum With 3.3-V Supply
- ΔRON Matching
- 2.5-Ω (Max) at 12 V
- 3-Ω (Max) at 5 V
- 3.5-Ω (Max) at 3.3 V
- Specified Low OFF-Leakage Currents:
- 1 nA at 25°C
- 10 nA at 85°C
- Specified Low ON-Leakage Currents:
- 1 nA at 25°C
- 10 nA at 85&25;C
- Low Charge Injection: 11.5 pC (12-V Supply)
- Fast Switching Speed:
tON = 80 ns, tOFF = 50 ns
(12-V Supply) - Break-Before-Make Operation (tON > tOFF)
- TTL/CMOS-Logic Compatible With 5-V Supply
- Available in 14-Pin TSSOP Package or 14-Pin
SOIC Package
Description
The TS12A44513, TS12A44514, and TS12A44515 devices have four bidirectional single-pole single-throw (SPST) single-supply CMOS analog switches. The TS12A44513 has two normally closed (NC) switches and two normally open (NO) switches, the TS12A44514 has four NO switches, and the TS12A44515 has four NC switches.
These CMOS switches may operate continuously with a single supply from 2 V to 12 V and can handle rail-to-rail analog signals. The OFF-leakage current maximum is only 1 nA at 25°C or 10 nA at 85°C.
When using a 5-V supply, all digital inputs have 0.8-V to 2.4-V logic thresholds, ensuring TTL/CMOS-logic compatibility.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TS12A4451x Low ON-State Resistance 4-Channel SPST CMOS Analog Switches datasheet (Rev. B) | Feb. 01, 2016 |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Application note | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOIC (D) | 14 | View options |
TSSOP (PW) | 14 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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