5-V, 2:1 (SPDT), 1-channel general-purpose analog switch with overshoot & undershood protection
Product details
Parameters
Package | Pins | Size
Features
- Overshoot and Undershoot Voltage Protection
- Isolation in Powered-Off Mode, V+ = 0 V
- Specified Break-Before-Make Switching
- Low ON-State Resistance (12 Ω)
- Control Inputs Are 5-V Tolerant
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion (THD)
- 1.65-V to 5.5-V Single-Supply Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
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Description
The TS5A63157 is a single-pole, double-throw (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. Signals up to V+ (peak) can be transmitted in either direction.
TI has integrated overshoot and undershoot protection circuitry. The TS5A63157 senses overshoot and undershoot events at the I/Os and responds by preventing voltage differentials from developing and turning the switch on.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TS5A63157 12-Ω SPDT analog switch 5-V/3.3-V single-channel 2:1 multiplexer/demultiplexer datasheet (Rev. B) | Mar. 21, 2019 |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Application note | Eliminate power Sequencing with powered-off protection signal switches (Rev. B) | Jan. 15, 2019 | |
Application note | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Reference designs
Design files
-
download Ultrasonic Waterflow Measurement Gerber BOM.pdf (99KB) -
download Ultrasonic Waterflow Measurement Gerber Assembly Drawing.pdf (91KB) -
download Ultrasonic Waterflow Measurement Gerber Layer Plots.zip (399KB) -
download Ultrasonic Waterflow Measurement Gerber CAD FIles.zip (214KB) -
download Ultrasonic Waterflow Measurement Gerber.zip (81KB) -
download Ultrasonic Waterflow Measurement Gerber Software.zip (129KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SC70 (DCK) | 6 | View options |
SOT-23 (DBV) | 6 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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