The certified WiLink™ 8 module from TI offers a high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1837MOD only) in a power-optimized design. The WL18x7MOD is a Wi-Fi, dual-band, 2.4GHz and 5GHz module solution with two antennas supporting industrial temperature grade. The device is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which include QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.
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The DM38x Camera Starter Kit (CSK) enables developers to begin designing wireless or wired connected digital video applications, such as security cameras, car DVRs, endoscopes, action-wearable cameras, drones, video doorbells, baby monitors, and other connected video products.
The DM38x (...)
The AM437x Evaluation Module (EVM), TMDXEVM437X, enables developers to immediately start evaluating the AM437x processor family (AM4372, AM4376,AM4377, AM4378) and begin building applications and accelerate development for HMI, industrial and networking applications. The TMDSEVM437X development (...)
The AM335x Evaluation Module (EVM) enables developers to immediately start evaluating the AM335x processor family (AM3351, AM3352, AM3354, AM3356, AM3358) and begin building applications for factory automation, building automation, grid infrastructure, and more.
The WiLink SDIO board is a SDMMC adapter board and is an easy to use connector between a WiLink COM8 Evaluation module [WL1837MODCOM8i and WL1835MODCOM8B] and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO. It also provides (...)
The WL1835MODCOM8 is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5 GHz band and extended temperature range, see the WL1837MODCOM8I.
The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add (...)
The WL1837MODCOM8I, which is compatible with many processors including TI’s (...)
Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
This package includes the following applications:
The applications provide all of the capabilities required to debug and monitor WiLink™ WLAN/Bluetooth/Bluetooth low (...)
This package contains the install package, pre-compiled object of the TI Bluetooth Stack and Platform Manager, and pre-compiled object with source of sample applications to easily upgrade the default LINUX EZSDK Binary on an AM335x EVM. The software was built with Linaro GCC 4.7 and can be added to (...)
The MCP package contains the install package, pre-compiled object and source of the proprietary Wi-Fi Driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, µC, MQX ,RTX and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through (...)
WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide
WL18xx Linux driver uses the open source components along with the interface (...)
The Bluetooth Service Pack is composed of the following four files:
Note the version in the file name is unique for combination of hardware and firmware, but is not (...)
ClariFi™ provides an in-built protocol analyzer support for faster debugging of complex wireless devices and is used with our user-friendly SoftFrame abstraction layer middleware. It offers threading, memory usage, and memory leak analysis. Together these tools support the tuning of applications (...)
ClarinoxBlue™ protocol stack was designed by embedded developers for embedded developers. With a simple and flexible approach, the ClarinoxBlue protocol stack enables you to spend more time on your application rather than the inner workings of Bluetooth technology. Designed for Bluetooth Classic (...)
ClarinoxWiFi is a proven Wi-Fi protocol stack with AP,STA,P2P and Mesh roles, while also boasting support for a large range of different RTOS/MCU. ClarinoxWiFi empowers developers to create reliable and high-performance Wi-Fi connections, for a wide range of wireless embedded applications.
For (...)
To get started with the WiLink™ hardware design review process:
The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way it's been certified. Through this, customers are able to evaluate the performance of the module through (...)
The TI WiLink™ 8 WL1837MOD audio cape is a wireless multi-room audio reference design used with BeagleBone Black (featuring TI Sitara™ AM335x). The WiLink 8 device's WLAN capability to capture and register precise arrival time of the connected AP's beacon is used to achieve ultra-precise (...)
The WiLink 1837 module antenna design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way it's been certified. Through this, customers are able to evaluate the performance of the module through (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| QFM (MOC) | 100 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
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