SWRS170I August   2014  – October 2017 WL1807MOD , WL1837MOD

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Attributes
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  External Digital Slow Clock Requirements
    5. 5.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 5.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 5.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 5.8  WLAN Performance: 5-GHz Receiver Characteristics
    9. 5.9  WLAN Performance: 5-GHz Transmitter Power
    10. 5.10 WLAN Performance: Currents
    11. 5.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 5.12 Bluetooth Performance: Transmitter, BR
    13. 5.13 Bluetooth Performance: Transmitter, EDR
    14. 5.14 Bluetooth Performance: Modulation, BR
    15. 5.15 Bluetooth Performance: Modulation, EDR
    16. 5.16 Bluetooth low energy Performance: Receiver Characteristics - In-Band Signals
    17. 5.17 Bluetooth low energy Performance: Transmitter Characteristics
    18. 5.18 Bluetooth low energy Performance: Modulation Characteristics
    19. 5.19 Bluetooth BR and EDR Dynamic Currents
    20. 5.20 Bluetooth low energy Currents
    21. 5.21 Timing and Switching Characteristics
      1. 5.21.1 Power Management
        1. 5.21.1.1 Block Diagram - Internal DC-DCs
      2. 5.21.2 Power-Up and Shut-Down States
      3. 5.21.3 Chip Top-level Power-Up Sequence
      4. 5.21.4 WLAN Power-Up Sequence
      5. 5.21.5 Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 5.21.6 WLAN SDIO Transport Layer
        1. 5.21.6.1 SDIO Timing Specifications
        2. 5.21.6.2 SDIO Switching Characteristics - High Rate
      7. 5.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 5.21.7.1 UART 4-Wire Interface - H4
      8. 5.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  6. 6Detailed Description
    1. 6.1 WLAN Features
    2. 6.2 Bluetooth Features
    3. 6.3 Bluetooth low energy Features
    4. 6.4 Device Certification
      1. 6.4.1 FCC Certification and Statement
      2. 6.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 6.4.3 ETSI/CE
      4. 6.4.4 MIC Certification
    5. 6.5 Module Markings
    6. 6.6 Test Grades
    7. 6.7 End Product Labeling
    8. 6.8 Manual Information to the End User
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application - WL1837MOD Reference Design
      2. 7.1.2 Design Recommendations
      3. 7.1.3 RF Trace and Antenna Layout Recommendations
      4. 7.1.4 Module Layout Recommendations
      5. 7.1.5 Thermal Board Recommendations
      6. 7.1.6 Baking and SMT Recommendations
        1. 7.1.6.1 Baking Recommendations
        2. 7.1.6.2 SMT Recommendations
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Tools and Software
      3. 8.1.3 Device Support Nomenclature
    2. 8.2 Related Links
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 TI Module Mechanical Outline
    2. 9.2 Tape and Reel Information
      1. 9.2.1 Tape and Reel Specification
      2. 9.2.2 Packing Specification
        1. 9.2.2.1 Reel Box
        2. 9.2.2.2 Shipping Box
    3. 9.3 Packaging Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)

Device Overview

Features

  • General
    • Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives, and Power Management
    • Quick Hardware Design With TI Module Collateral and Reference Designs
    • Operating Temperature: –40°C to +85°C Industrial Temperature Grade
    • Small Form Factor: 13.3 × 13.4 × 2 mm
    • 100-Pin MOC Package
    • FCC, IC, ETSI/CE, and TELEC Certified With PCB, Dipole, Chip, and PIFA Antennas
  • Wi-Fi®
    • WLAN Baseband Processor and RF Transceiver Support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC Support for Extended Range and 5-GHz Diversity Capable
    • Fully Calibrated: Production Calibration Not Required
    • 4-Bit SDIO Host Interface Support
    • Wi-Fi Direct Concurrent Operation (Multichannel, Multirole)
  • Bluetooth® and Bluetooth low energy (WL1837MOD Only)
    • Bluetooth 4.2 Secure Connection Compliant and CSA2 Support (Declaration ID: D032800)
    • Host Controller Interface (HCI) Transport for Bluetooth Over UART
    • Dedicated Audio Processor Support of SBC Encoding + A2DP
    • Dual-Mode Bluetooth and Bluetooth Low Energy
    • TI's Bluetooth- and Bluetooth Low Energy-Certified Stack
  • Key Benefits
    • Reduces Design Overhead
    • Differentiated Use Cases by Configuring WiLink™ 8 Simultaneously in Two Roles (STA and AP) to Connect Directly With Other Wi-Fi Devices on Different RF Channel (Wi-Fi Networks)
    • Best-in-Class Wi-Fi With High-Performance Audio and Video Streaming Reference Applications With Up to 1.4× the Range Versus One Antenna
    • Different Provisioning Methods for In-Home Devices Connectivity to Wi-Fi in One Step
    • Lowest Wi-Fi Power Consumption in Connected Idle (< 800 µA)
    • Configurable Wake on WLAN Filters to Only Wake Up the System
    • Wi-Fi-Bluetooth Single Antenna Coexistence

Applications

  • Internet of Things (IoT)
  • Multimedia
  • Home Electronics
  • Home Appliances and White Goods
  • Industrial and Home Automation
  • Smart Gateway and Metering
  • Video Conferencing
  • Video Camera and Security

Description

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1837MOD only) in a power-optimized design. The WL18x7MOD is a Wi-Fi, dual-band, 2.4- and 5-GHz module solution with two antennas supporting Industrial temperature grade. The device is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux® and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE
WL1807MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm
WL1837MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm
For more information, see Section 9.

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Functional Block Diagram

Figure 1-1 shows a functional block diagram of the WL1837MOD variant.

WL1807MOD WL1837MOD WL1837_module_concept__SWRS170.gif
NOTE: Dashed lines indicate optional configurations and are not applied by default.
Figure 1-1 WL1837MOD Functional Block Diagram