AM3715

AKTIV

Sitara-Prozessor: Arm Cortex-A8, 3D Grafik, Kamera

Produktdetails

CPU 1 Arm Cortex-A8 Frequency (MHz) 1000 Graphics acceleration 1 3D Display type 1 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Security Cryptographic acceleration Rating Catalog Operating temperature range (°C) -40 to 105
CPU 1 Arm Cortex-A8 Frequency (MHz) 1000 Graphics acceleration 1 3D Display type 1 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Security Cryptographic acceleration Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBC) 515 196 mm² 14 x 14 FCCSP (CBP) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • AM3715, AM3703 Sitara ARM Microprocessors:
    • Compatible to OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
      • NEON SIMD Coprocessor
    • POWERVR SGX™ Graphics Accelerator (AM3715 only)
      • Tile Based Architecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
      • Interfaces to Low-Power SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-bit Wide Multiplexed Address/Data Bus
      • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
      • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)

POWERVR SGX is a trademark of Imagination Technologies Ltd.

OMAP is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

  • AM3715, AM3703 Sitara ARM Microprocessors:
    • Compatible to OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
      • NEON SIMD Coprocessor
    • POWERVR SGX™ Graphics Accelerator (AM3715 only)
      • Tile Based Architecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
      • Interfaces to Low-Power SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-bit Wide Multiplexed Address/Data Bus
      • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
      • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)

POWERVR SGX is a trademark of Imagination Technologies Ltd.

OMAP is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.

The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.

The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:

  • A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.

The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.

The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:

  • A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet AM3715, AM3703 Sitara ARM Microprocessors datasheet (Rev. F) 29 Aug 2011
* Errata AM3715, AM3703 Microprocessors Silicon Errata (Silicon Revisions 1.2 1.1 & 1.0) (Rev. F) 13 Feb 2014
* User guide AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 24 Sep 2012
More literature From Start to Finish: A Product Development Roadmap for Sitara™ Processors 16 Dez 2020
Application note (Cancelled - see the B revision, create by mistake 14-may-2009) (Rev. C) PDF | HTML 03 Mär 2020
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 20 Mär 2019
User guide How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS 24 Sep 2018
Technical article Spring has sprung. A sale has sprung. PDF | HTML 04 Apr 2016
Application note PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 01 Nov 2013
White paper AM37x power-saving techniques lead to ultra-low-power for battery-operated appli 08 Apr 2013
User guide Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 10 Sep 2012
Application note PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 15 Jun 2011
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 23 Jun 2010
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 23 Jun 2010
Application note AM/DM37x Power Estimation Spreadsheet 07 Jun 2010
Application note AM/DM37x Overview 03 Jun 2010
Application note AM3715/03 Memory Subsystem 03 Jun 2010
Application note AM37x CUS Routing Guidelines 03 Jun 2010
Application note Migrating from OMAP3530 to AM37x 03 Jun 2010
Application note Setting up AM37x SDRC Registers 03 Jun 2010

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Debug-Tastkopf

TMDSEMU200-U — XDS200-USB-Debug-Tastkopf

Der XDS200 ist ein Debug-Tastkopf (Emulator) zum Debugging von Embedded-Bausteinen von TI. Für die meisten Bausteine wird die Verwendung der neueren, kostengünstigeren XDS110 (www.ti.com/tool/TMDSEMU110-U) empfohlen. Der XDS200 unterstützt eine große Zahl von Standards (IEEE1149.1, IEEE1149.7, SWD) (...)

Debug-Tastkopf

TMDSEMU560V2STM-U — XDS560v2 System-Trace-USB-Debug-Tastkopf

Der XDS560v2 ist die leistungsstärkste Debug-Sonde aus der XDS560™ Familie von Debug-Sonden und unterstützt sowohl den traditionellen JTAG-Standard (IEEE1149.1) als auch cJTAG (IEEE1149.7).  Bitte beachten: Diese Lösung unterstützt kein Serial Wire Debug (SWD).

Alle XDS-Debug-Tastköpfe unterstützen (...)

Debug-Tastkopf

TMDSEMU560V2STM-UE — XDS560v2 System-Trace-USB-und Ethernet-Debug-Tastkopf

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

Software-Entwicklungskit (SDK)

ANDROIDSDK-SITARA — Android-Entwicklungskit für Sitara-Mikroprozessoren

Obwohl das Android-Betriebssystem ursprünglich für Mobiltelefone entwickelt wurde, bietet es Entwicklern von Embedded-Anwendungen die Möglichkeit, ihr Produkt auf einfache Weise mit einem leistungsstarken Betriebssystem auszustatten. Android wurde in Zusammenarbeit mit Google entwickelt und liefert (...)
Software-Entwicklungskit (SDK)

LINUXEZSDK-AM37X Linux EZ SDK for AM3715, AM3703

SITARA LINUX SDK

Linux Software Development Kits (SDK) provide Sitara™ developers with an easy set up and quick out-of-box experience that is specific to and highlights the features of TI's ARM processors. Launching demos, benchmarks and applications is a snap with the included graphical user (...)

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Treiber oder Bibliothek

WIND-3P-VXWORKS-LINUX-OS — Wind-River-Prozessoren VxWorks und Linux-Betriebssysteme

Wind River is a global leader in delivering software for the Internet of Things (IoT). The company’s technology has been powering the safest, most secure devices in the world since 1981 and today is found in more than 2 billion products. Wind River offers a comprehensive edge-to-cloud product (...)
IDE, Konfiguration, Compiler oder Debugger

CCSTUDIO Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

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Betriebssystem (BS)

GHS-3P-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS

The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
Betriebssystem (BS)

MG-3P-NUCLEUS-RTOS — Mentor Grafik Nucleus RTOS

Software driven power management is crucial for battery operated or low power budget embedded systems. Embedded developers can now take advantage of the latest power saving features in popular TI devices with the built-in Power Management Framework in the Nucleus RTOS. Developers specify (...)
Betriebssystem (BS)

QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

Das QNX Neutrino® Realtime Operating System (RTOS) ist ein voll ausgestattetes und robustes RTOS, das die nächste Generation von Produkten für eingebettete Systeme in den Bereichen Automobilindustrie, Medizintechnik, Transport, Militär und Industrie ermöglicht. Das Mikrokernel-Design und die (...)
Software-Programmiertool

FLASHTOOL FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

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TI E2E Community

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Software-Programmiertool

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

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Simulationsmodell

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507B.ZIP (8 KB) - BSDL Model
Simulationsmodell

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS Model
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AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL Model
Simulationsmodell

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS Model
Simulationsmodell

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL Model
Simulationsmodell

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS Model
Berechnungstool

CLOCKTREETOOL — Taktbaum-Tool für Sitara, Automobilanwendungen, Sichtanalytik und digitale Signalprozessoren

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
Benutzerhandbuch: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
FCCSP (CBC) 515 Ultra Librarian
FCCSP (CBP) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian

Bestellen & Qualität

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  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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