Produktdetails

CPU 2 Arm Cortex-A15 Frequency (MHz) 1500 Coprocessors 4 Arm Cortex-M4 Graphics acceleration 1 2D, 2 3D Display type 1 HDMI, 3 LCD Protocols Ethernet, ICSS, Profibus, Profinet PCIe 2 PCIe Gen 2 Hardware accelerators Embedded vision engines Operating system Android, Linux, RTOS Rating Catalog Power supply solution LP8733 + LP873220, TPS65916 Operating temperature range (°C) -40 to 105 Edge AI enabled No
CPU 2 Arm Cortex-A15 Frequency (MHz) 1500 Coprocessors 4 Arm Cortex-M4 Graphics acceleration 1 2D, 2 3D Display type 1 HDMI, 3 LCD Protocols Ethernet, ICSS, Profibus, Profinet PCIe 2 PCIe Gen 2 Hardware accelerators Embedded vision engines Operating system Android, Linux, RTOS Rating Catalog Power supply solution LP8733 + LP873220, TPS65916 Operating temperature range (°C) -40 to 105 Edge AI enabled No
FCBGA (ABC) 760 529 mm² (23 mm × 23 mm)
  • Dual Arm® Cortex®-A15 microprocessor subsystem
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 2.5MB of on-chip L3 RAM
  • Two DDR3/DDR3L memory interface (EMIF) modules
    • Supports up to DDR3-1066
    • Up to 2GB supported per EMIF
  • 2x dual Arm® Cortex®-M4 co-processors (IPU1 and IPU2)
  • Up to four Embedded Vision Engines (EVEs)
  • IVA-HD subsystem
    • 4K @ 15fps encode and decode support for H.264 CODEC
    • Other CODECs are up to 1080p60
  • Display subsystem
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video input and video output
    • 2D and 3D graphics
    • Display controller with DMA engine and up to three pipelines
    • HDMI® encoder: HDMI 1.4a and DVI 1.0 compliant
  • 2x dual-core Programmable Real-Time Unit and Industrial Communication SubSystem (PRU-ICSS)
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • Dual-core PowerVR® SGX544™ 3D GPU
  • Crypto hardware accelerators
    • AES, SHA, RNG, DES and 3DES
  • Three video Input Port (VIP) modules
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-port gigabit ethernet (GMAC)
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Five Inter-Integrated Circuit (I2C™) ports
  • HDQ™/1-Wire® interface
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface (QSPI)
  • SATA gen2 interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High-speed USB 2.0 dual-role device
  • Four Multimedia Card/Secure Digital/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
  • PCI-Express® 3.0 subsystems with two 5-Gbps lanes
    • One 2-lane gen2-compliant port
    • or two 1-lane gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • Up to 247 General-Purpose I/O (GPIO) pins
  • Power, Reset, and Clock Management (PRCM)
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm pitch, 760-pin BGA (ABC)
  • Dual Arm® Cortex®-A15 microprocessor subsystem
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 2.5MB of on-chip L3 RAM
  • Two DDR3/DDR3L memory interface (EMIF) modules
    • Supports up to DDR3-1066
    • Up to 2GB supported per EMIF
  • 2x dual Arm® Cortex®-M4 co-processors (IPU1 and IPU2)
  • Up to four Embedded Vision Engines (EVEs)
  • IVA-HD subsystem
    • 4K @ 15fps encode and decode support for H.264 CODEC
    • Other CODECs are up to 1080p60
  • Display subsystem
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video input and video output
    • 2D and 3D graphics
    • Display controller with DMA engine and up to three pipelines
    • HDMI® encoder: HDMI 1.4a and DVI 1.0 compliant
  • 2x dual-core Programmable Real-Time Unit and Industrial Communication SubSystem (PRU-ICSS)
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • Dual-core PowerVR® SGX544™ 3D GPU
  • Crypto hardware accelerators
    • AES, SHA, RNG, DES and 3DES
  • Three video Input Port (VIP) modules
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-port gigabit ethernet (GMAC)
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Five Inter-Integrated Circuit (I2C™) ports
  • HDQ™/1-Wire® interface
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface (QSPI)
  • SATA gen2 interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High-speed USB 2.0 dual-role device
  • Four Multimedia Card/Secure Digital/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
  • PCI-Express® 3.0 subsystems with two 5-Gbps lanes
    • One 2-lane gen2-compliant port
    • or two 1-lane gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • Up to 247 General-Purpose I/O (GPIO) pins
  • Power, Reset, and Clock Management (PRCM)
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm pitch, 760-pin BGA (ABC)

AM572x Sitara™ processors are Arm applications processors built to meet the intense processing needs of modern embedded products.

AM572x devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The devices also combine programmable video processing with a highly integrated peripheral set. Cryptographic acceleration is available in every AM572x device.

Programmability is provided by dual-core Arm® Cortex®-A15 RISC CPUs with Arm® Neon™ extension, and two TI C66x VLIW floating-point DSP core, and Vision AccelerationPac (with 4x EVEs). The Arm allows developers to keep control functions separate from other algorithms programmed on the DSPs and coprocessors, thus reducing the complexity of the system software.

Additionally, TI provides a complete set of development tools for the Arm and C66x DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

AM572x Sitara™ processors are Arm applications processors built to meet the intense processing needs of modern embedded products.

AM572x devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The devices also combine programmable video processing with a highly integrated peripheral set. Cryptographic acceleration is available in every AM572x device.

Programmability is provided by dual-core Arm® Cortex®-A15 RISC CPUs with Arm® Neon™ extension, and two TI C66x VLIW floating-point DSP core, and Vision AccelerationPac (with 4x EVEs). The Arm allows developers to keep control functions separate from other algorithms programmed on the DSPs and coprocessors, thus reducing the complexity of the system software.

Additionally, TI provides a complete set of development tools for the Arm and C66x DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Neueste englische Version herunterladen Datum
* Datenblatt AM572x Sitara™ Processors Silicon Revision 2.0 datasheet (Rev. G) PDF | HTML 25.11.2019
* Benutzerhandbuch AM572x Sitara Processor Technical Reference Manual (Rev. L) 05.07.2019
* Errata AM572x Sitara Processors Silicon Errata (Silicon Revision 2.0, 1.1) (Rev. N) PDF | HTML 13.06.2024
Anwendungshinweis HSR/PRP Solutions on Sitara Processors for Grid Substation Communication (Rev. A) PDF | HTML 30.01.2026
Anwendungshinweis Sitara Processor Power Distribution Networks: Implementation and Analysis (Rev. H) PDF | HTML 17.10.2025
Anwendungshinweis Industrial Communication Protocols Supported on TI Processors and MCUs (Rev. F) PDF | HTML 03.09.2025
Whitepaper Time Sensitive Networking for Industrial Automation (Rev. C) PDF | HTML 31.07.2023
Anwendungshinweis Intra Drive Communication Using 8b-10b Line Code With Programmable Real Time Uni PDF | HTML 24.05.2023
Anwendungshinweis High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 24.02.2023
Anwendungshinweis PRU-ICSS Feature Comparison (Rev. G) PDF | HTML 11.10.2022
Anwendungshinweis Ethernet PHY Configuration Using MDIO for Industrial Applications (Rev. A) 07.05.2021
Application brief Adding Real-Time Communication to Linux (Rev. A) 07.05.2021
Weitere Dokumente From Start to Finish: A Product Development Roadmap for Sitara™ Processors 16.12.2020
E-book Ein Techniker-Leitfaden für Industrieroboter-Designs Download English Version 25.03.2020
Anwendungshinweis AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 06.01.2020
Technischer Artikel Maximizing machine-learning inference at the edge PDF | HTML 02.12.2019
Weitere Dokumente AM572x Industrial Development Kit Quick Start Guide (Rev. B) 08.10.2019
Anwendungshinweis AM57x Schematic Checklist (Rev. B) 09.07.2019
Anwendungshinweis Calculating Useful Lifetimes of Embedded Processors (Rev. B) PDF | HTML 07.05.2019
Anwendungshinweis AM571x/AM572x/AM574x PCB Escape Routing (Rev. A) 19.03.2019
Whitepaper Virtualization for embedded industrial systems (Rev. B) 07.03.2019
Whitepaper Bringing deep learning to embedded systems (Rev. A) 26.02.2019
Anwendungshinweis Common EOS pitfalls in board design PDF | HTML 13.02.2019
Anwendungshinweis AM57xx Hardware Design Guide PDF | HTML 25.01.2019
Anwendungshinweis PRU-ICSS Getting Started Guide on TI-RTOS (Rev. A) 18.01.2019
Anwendungshinweis McASP Design Guide - Tips, Tricks, and Practical Examples 10.01.2019
Anwendungshinweis PRU Read Latencies (Rev. A) 21.12.2018
Anwendungshinweis AM572x Thermal Considerations (Rev. A) 13.12.2018
Anwendungshinweis PRU-ICSS Getting Starting Guide on Linux (Rev. A) PDF | HTML 10.12.2018
Whitepaper Ensuring real-time predictability (Rev. B) 04.12.2018
Anwendungshinweis PRU-ICSS EtherCAT Slave Troubleshooting Guide 07.11.2018
Anwendungshinweis PRU-ICSS / PRU_ICSSG Migration Guide PDF | HTML 05.11.2018
Whitepaper Secure Boot on embedded Sitara™ processors (Rev. A) 13.10.2018
Benutzerhandbuch How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS 24.09.2018
Anwendungshinweis MMC DLL Tuning (Rev. B) 31.07.2018
Whitepaper Designing professional audio mixers for every scenario 28.06.2018
Anwendungshinweis AM574x, AM572x, and AM571x Compatibility Guide (Rev. E) 26.04.2018
Benutzerhandbuch TPS659037 user's guide to power AM574x, AM572x, and AM571x (Rev. F) 16.03.2018
Benutzerhandbuch PRU Assembly Instruction User Guide 16.02.2018
Anwendungshinweis 2D Object Recognition for Industrial Machine Vision with Processor SDK on Sitara 07.02.2018
Anwendungshinweis AM57xx BGA PCB Design 25.08.2017
Anwendungshinweis Thermal Design Guide for DSP and Arm Application Processors (Rev. B) 14.08.2017
Anwendungshinweis IODELAY Application Note for AM57xx Devices (Rev. A) PDF | HTML 03.08.2017
Anwendungshinweis Processor-SDK RTOS Power Management and Measurement 02.08.2017
Anwendungshinweis AM572x Power Estimation Tool 19.07.2017
Anwendungshinweis Processor SDK RTOS Audio Benchmark Starter Kit 12.04.2017
Anwendungshinweis AM572x Power Consumption Summary 27.03.2017
Anwendungshinweis DSPLIB for Processor SDK RTOS 04.11.2016
Anwendungshinweis AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne 06.10.2016
Anwendungshinweis Keystone EDMA FAQ 01.09.2016
Whitepaper Enable security and amp up chip performance w/ hardware-accelerated cryptograpy (Rev. A) 11.08.2016
Product overview Sitara™ AM5x processor with ARM® Cortex™-A15 core (Rev. A) 22.01.2016
Anwendungshinweis TI DSP Benchmarking PDF | HTML 13.01.2016
Anwendungshinweis AM572x GP EVM Power Simulations 08.10.2015
Anwendungshinweis Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 13.08.2015
Whitepaper TI’s processors leading the way in embedded analytics 03.03.2015
Whitepaper Mainline Linux™ ensures stability and innovation 27.03.2014
Whitepaper Scalable Solutions for HMI 21.11.2013
Whitepaper Linaro Speeds Development in TI Linux SDKs PDF | HTML 27.08.2013
Whitepaper The Yocto Project:Changing the way embedded Linux software solutions are develop 14.03.2013
Anwendungshinweis AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) 01.05.2004

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