Produktdetails

Processor External MCU Type Module, Wireless network processor Technology Wi-Fi Protocols Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Operating system FreeRTOS, TI RTOS Certifications CE, FCC, ISED, MIC, Wi-Fi CERTIFIED Chip Throughput UDP (max) (Mbps) 16 Features 16 secure sockets, 2.4-GHz coexistence, 4 STAs, 802.11abgn, IPv4 & IPv6 Security Cryptographic acceleration, Device attestation & anti-counterfeit, FIPS 140-2 Level 1, Secure communication, Secure firmware & software update, Secure storage Rating Catalog Operating temperature range (°C) -40 to 85
Processor External MCU Type Module, Wireless network processor Technology Wi-Fi Protocols Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Operating system FreeRTOS, TI RTOS Certifications CE, FCC, ISED, MIC, Wi-Fi CERTIFIED Chip Throughput UDP (max) (Mbps) 16 Features 16 secure sockets, 2.4-GHz coexistence, 4 STAs, 802.11abgn, IPv4 & IPv6 Security Cryptographic acceleration, Device attestation & anti-counterfeit, FIPS 140-2 Level 1, Secure communication, Secure firmware & software update, Secure storage Rating Catalog Operating temperature range (°C) -40 to 85
QFM (MOB) 63 358.75 mm² 20.5 x 17.5
  • Fully integrated and green/RoHS module includes all required clocks, serial peripheral interface (SPI) flash, and passives
  • Integrated Wi-Fi® and internet protocols
  • 802.11a/b/g/n: 2.4GHz and 5GHz
  • FCC, IC/ISED, ETSI/CE, and MIC certified
  • FIPS 140-2 Level 1 validated IC inside
  • Rich set of IoT security features helps developers protect data
  • Low-power modes for battery powered application
  • Coexistence with 2.4GHz radios
  • Industrial temperature: –40°C to +85°C
  • Wi-Fi network processor subsystem:
    • Wi-Fi core:
      • 802.11 a/b/g/n 2.4GHz and 5GHz
      • Modes:
        • Access Point (AP)
        • Station (STA)
        • Wi-Fi Direct (only supported on 2.4GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
        • WPA3™ Personal
        • WPA3™ Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always on, intermittently connected, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Application throughput
    • UDP: 16Mbps
    • TCP: 13Mbps
  • Multilayered Security Features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • File system security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Recovery mechanism – ability to recover to factory defaults
  • Power-Management Subsystem:
    • Integrated DC/DC converters support a wide range of supply voltage:
      • Single wide-voltage supply, VBAT: 2.3V to 3.6V
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 5.5µA
      • Low-power deep sleep (LPDS): 115µA
      • Idle connected (MCU in LPDS): 710µA
      • RX traffic (MCU active): 53mA
      • TX traffic (MCU active): 223mA
  • Wi-Fi TX power
    • 2.4GHz: 16dBm at 1 DSSS
    • 5GHz: 15.1dBm at 6 OFDM
  • Wi-Fi RX sensitivity
    • 2.4GHz: –94.5dBm at 1 DSSS
    • 5GHz: –89dBm at 6 OFDM
  • Additional integrated components on module
    • 40.0MHz crystal with internal oscillator
    • 32.768kHz crystal (RTC)
    • 32Mbit SPI Serial Flash
    • RF filters, diplexer, and passive components
  • QFM package
    • 1.27mm pitch, 63-pin, 20.5mm × 17.5mm QFM package for easy assembly and low-cost PCB design
  • Module supports SimpleLink Developers Ecosystem
  • Fully integrated and green/RoHS module includes all required clocks, serial peripheral interface (SPI) flash, and passives
  • Integrated Wi-Fi® and internet protocols
  • 802.11a/b/g/n: 2.4GHz and 5GHz
  • FCC, IC/ISED, ETSI/CE, and MIC certified
  • FIPS 140-2 Level 1 validated IC inside
  • Rich set of IoT security features helps developers protect data
  • Low-power modes for battery powered application
  • Coexistence with 2.4GHz radios
  • Industrial temperature: –40°C to +85°C
  • Wi-Fi network processor subsystem:
    • Wi-Fi core:
      • 802.11 a/b/g/n 2.4GHz and 5GHz
      • Modes:
        • Access Point (AP)
        • Station (STA)
        • Wi-Fi Direct (only supported on 2.4GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
        • WPA3™ Personal
        • WPA3™ Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always on, intermittently connected, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Application throughput
    • UDP: 16Mbps
    • TCP: 13Mbps
  • Multilayered Security Features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • File system security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Recovery mechanism – ability to recover to factory defaults
  • Power-Management Subsystem:
    • Integrated DC/DC converters support a wide range of supply voltage:
      • Single wide-voltage supply, VBAT: 2.3V to 3.6V
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 5.5µA
      • Low-power deep sleep (LPDS): 115µA
      • Idle connected (MCU in LPDS): 710µA
      • RX traffic (MCU active): 53mA
      • TX traffic (MCU active): 223mA
  • Wi-Fi TX power
    • 2.4GHz: 16dBm at 1 DSSS
    • 5GHz: 15.1dBm at 6 OFDM
  • Wi-Fi RX sensitivity
    • 2.4GHz: –94.5dBm at 1 DSSS
    • 5GHz: –89dBm at 6 OFDM
  • Additional integrated components on module
    • 40.0MHz crystal with internal oscillator
    • 32.768kHz crystal (RTC)
    • 32Mbit SPI Serial Flash
    • RF filters, diplexer, and passive components
  • QFM package
    • 1.27mm pitch, 63-pin, 20.5mm × 17.5mm QFM package for easy assembly and low-cost PCB design
  • Module supports SimpleLink Developers Ecosystem

The CC3135MOD is an FCC, IC/ISED, ETSI/CE, MIC, and Wi-Fi CERTIFIED™ module that dramatically simplifies the implementation of Internet connectivity. This dual-band Wi-Fi network processor module can be added to any low-cost, low-power microcontroller unit (MCU); it integrates all protocols for Wi-Fi® and Internet, which greatly minimize host MCU software requirements.

This ROM-based subsystem includes an 802.11 a/b/g/n dual-band 2.4 GHz and 5 GHz radio, baseband, and MAC with powerful hardware cryptographic engine. With built-in security protocols, the CC3135MOD solution provides a robust and simple security experience. The CC3135MOD is available in an LGA package that is easy to lay out with all required components including serial Flash, RF filters, diplexer, crystal, and passive components that are fully integrated.

This generation introduces new capabilities that further simplify the connectivity of things to the Internet. The main new features of CC3135MOD include:

  • 802.11 a/b/g/n: 2.4 GHz and 5 GHz support
  • 2.4 GHz Coexistence with Bluetooth low energy radio
  • Antenna diversity
  • Enhanced security with FIPS 140-2 level 1 validated IC inside: certification
  • More concurrent secure sockets, up to 16
  • Unique device identifier with ability to generate certificate signing request (CSR)
  • Online certificate status protocol (OCSP)
  • Wi-Fi Alliance certified for IoT low power capabilities
  • Hostless mode for offloading template packet transmissions
  • Improved fast scan

The CC3135MOD device is part of the SimpleLink™ MCU platform—a common, easy-to-use development environment based on a single-core software development kit (SDK) with a rich tool set and reference designs. The E2E™ community supports Wi-Fi®, Bluetooth® low energy, Sub-1 GHz, and host MCUs. For more information, visit www.ti.com/SimpleLink.

The CC3135MOD is an FCC, IC/ISED, ETSI/CE, MIC, and Wi-Fi CERTIFIED™ module that dramatically simplifies the implementation of Internet connectivity. This dual-band Wi-Fi network processor module can be added to any low-cost, low-power microcontroller unit (MCU); it integrates all protocols for Wi-Fi® and Internet, which greatly minimize host MCU software requirements.

This ROM-based subsystem includes an 802.11 a/b/g/n dual-band 2.4 GHz and 5 GHz radio, baseband, and MAC with powerful hardware cryptographic engine. With built-in security protocols, the CC3135MOD solution provides a robust and simple security experience. The CC3135MOD is available in an LGA package that is easy to lay out with all required components including serial Flash, RF filters, diplexer, crystal, and passive components that are fully integrated.

This generation introduces new capabilities that further simplify the connectivity of things to the Internet. The main new features of CC3135MOD include:

  • 802.11 a/b/g/n: 2.4 GHz and 5 GHz support
  • 2.4 GHz Coexistence with Bluetooth low energy radio
  • Antenna diversity
  • Enhanced security with FIPS 140-2 level 1 validated IC inside: certification
  • More concurrent secure sockets, up to 16
  • Unique device identifier with ability to generate certificate signing request (CSR)
  • Online certificate status protocol (OCSP)
  • Wi-Fi Alliance certified for IoT low power capabilities
  • Hostless mode for offloading template packet transmissions
  • Improved fast scan

The CC3135MOD device is part of the SimpleLink™ MCU platform—a common, easy-to-use development environment based on a single-core software development kit (SDK) with a rich tool set and reference designs. The E2E™ community supports Wi-Fi®, Bluetooth® low energy, Sub-1 GHz, and host MCUs. For more information, visit www.ti.com/SimpleLink.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet SimpleLink™ Wi-Fi CC3135MOD Dual-Band Network Processor Module datasheet (Rev. E) PDF | HTML 06 Dez 2024
* Radiation & reliability report CC3135MOD Reliability Data – Reliability Estimate 25 Jun 2019
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 20 Okt 2022
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 Mär 2022
Selection guide Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B) 07 Mär 2022
Cybersecurity advisory TI-PSIRT-2021-100117 Integrated HTTP Server Ping Utility Vulnerability PDF | HTML 15 Jan 2022
Application note TI Wi-Fi Test Strategy Overview (Rev. A) 01 Jul 2021
Certificate CC3135MODRNMMOB EC Declaration of Conformity (DoC) (Rev. A) 03 Mär 2021
User guide SimpleLink™ Wi-Fi® CC3x20, CC3x3x Network Processor (Rev. M) PDF | HTML 30 Sep 2020
Application note CC3x20, CC3x35 SimpleLink™ Wi-Fi® Internet-on-a chip™ Solution Built-In Security (Rev. C) 29 Sep 2020
Application brief Wi-Fi® Enabled Electronic Smart Lock Security Application Brief (Rev. A) 29 Sep 2020
Application note SimpleLink™ Wi-Fi® CC3x20, CC3x3x Device Provisioning (Rev. C) PDF | HTML 18 Sep 2020
Application note SimpleLink™ Wi-Fi® CC3x20, CC3x3x Over-the-Air Update (Rev. B) 17 Sep 2020
Application note CE Compliance Test Procedure for TI’s WiFi Devices PDF | HTML 19 Aug 2020
Application note SimpleLink™ Wi-Fi® CC313x, CC323x BLE Coexistence (Rev. A) 17 Aug 2020
User guide SimpleLink™ Wi-Fi® CC3x20 and CC3x3x Provisioning for Mobile Applications (Rev. B) 17 Aug 2020
User guide SimpleLink™ Wi-Fi® CC3x20, CC3x3x Radio Tool User Guide (Rev. B) 17 Aug 2020
Application note SimpleLink™ Wi-Fi® CC3x3x Networking Subsystem Power Management (Rev. A) 17 Aug 2020
Application note SimpleLink™ Wi-Fi® CC3x3x Serial Flash (Rev. B) 17 Aug 2020
User guide UniFlash CC3x20, CC3x3x SimpleLink™ Wi-Fi® and IoC™ Solution ImageCreator (Rev. H) 17 Aug 2020
Certificate Product Information for CC3xxx Devices as Per Annex-E of EN 300 328 10 Aug 2020
Certificate Product Information for CC3xxx Devices as Per Annex-G of EN 301 893 10 Aug 2020
User guide CC3x35 Hardware Design Checklist (Rev. A) 17 Feb 2020
Application note Module Reliability for CC2xxxMODx, CC3xxxMODx, CC3xxxMODAx, and WL18xxMOD (Rev. A) 06 Feb 2020
Application note Transfer of TI Wi-Fi® Alliance Certifications to Products Using WFA Cert Policy (Rev. F) PDF | HTML 30 Jan 2020
Application note FIPS Compliant vs. FIPS Validated (Rev. A) 26 Jun 2019
White paper Low-Power Internet Connectivity Over Wi-Fi (Rev. A) 23 Mai 2019
White paper A primer to Wi-Fi® provisioning for IoT applications (Rev. A) 31 Jan 2019
Application note CC3135MOD Production Line Guide 12 Dez 2018
Application note CC3135MOD BoosterPack Hardware Design Files 12 Sep 2018
User guide CC3135MOD OEM Integrator’s Guide 12 Sep 2018
Application note CC313x and CC323x Simplelink™ Wi-Fi® Embedded Programming User's Guide 21 Mär 2018
User guide CC3135 SimpleLink™ Wi-Fi® BoosterPack™ Plug-in Module Hardware User’s Guide 01 Mär 2018

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

BOOSTXL-CC3135 — BoosterPack™-Plug-In-Modul für drahtlosen SimpleLink™ Wi-Fi® CC3135-Zweiband-Drahtlos-Netzwerkprozes

Der drahtlose SimpleLink™ Wi-Fi® CC3135-Netzwerkprozessor bietet Anwendern die Flexibilität, WLAN zu jedem Mikrocontroller (MCU) hinzuzufügen. Das Plug-in-Modul BoosterPack™ CC3135 (BOOSTXL-CC3135) ist eine Platine, die einfach mit den MCU-Launchpad-Kits von TI verbunden werden kann (...)
Benutzerhandbuch: PDF
Evaluierungsplatine

CC31XXEMUBOOST — Erweitertes Emulationskit für SimpleLink™ Wi-Fi ® CC31xx BoosterPack™-Steckmodul

This advanced emulation BoosterPack™ plug-in module is an accessory for the SimpleLink™ Wi-Fi® CC31xx wireless network processor BoosterPack plug-in modules

This accessory can be used for:

  1. Flashing updates to the CC31xxBOOST
  2. Using the CC3xxx radio tool for RF performance evaluation
  3. Using (...)
Benutzerhandbuch: PDF
Anwendungssoftware und Frameworks

WIFISTARTERPRO — SimpleLink™ Wi-Fi® Starter Pro

Im iTunes App Store herunterladen
In Google Play herunterladen

Die mobile App SimpleLink™ Wi-Fi® Starter Pro ist eine neue mobile Anwendung für die SimpleLink-Bereitstellung. Dazu gehört auch die eingebettete Bereitstellungsbibliothek und das Beispiel, das auf der Bausteinseite ausgeführt wird. Die (...)
IDE, Konfiguration, Compiler oder Debugger

CC3XXXRADIOTEST — SimpleLink™ Wi-Fi®-Funktest-Tool

Das SimpleLink™ Wi-Fi®-Funktesttool ist ein Windows-basiertes Softwaretool zur HF-Evaluierung und zum Testen von SimpleLink WLAN-CC31xx- und -CC32xx-Designs während der Entwicklung und Zertifizierung.  Das Tool ermöglicht Low-Level-Funktests, indem es das Funkgerät manuell in den Sende- oder (...)
IDE, Konfiguration, Compiler oder Debugger

CCSTUDIO — CCStudio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development tool ecosystem. It is an integrated development environment (IDE) for TI's microcontrollers, processors, wireless connectivity devices and radar sensors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize (...)
Benutzerhandbuch: PDF | HTML
Onlineschulungen

SIMPLELINK-ACADEMY-CC32XX SimpleLink™ Academy for CC32xx

SimpleLink Academy delivers easy-to-use training modules that span a wide range of topics for the SimpleLink Wi-Fi® evaluation platforms and software.
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Plug-in

SIMPLELINK-SDK-WIFI-PLUGIN SimpleLink™ software development kit (SDK) Wi-Fi® plug-in

The SimpleLink SDK Wi-Fi Plug-in contains drivers, many sample applications for Wi-Fi features and internet, and documentation needed to use the CC3120 or CC3135 Internet-on-a-chip™ solutions. This Plug-in is a companion software package that enables the use of a Wi-Fi radio on any standard (...)

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Software-Programmiertool

EMBEDDED-PROGRAMMING — SimpleLink™ Wi-Fi® eingebettete Programmierung

Jedes Produkt, das über einen integrierten CC3120/CC3220-Baustein verfügt, muss auch einen seriellen Flash-Baustein angeschlossen haben. Der serielle Flash muss formatiert und mindestens mit dem Service Pack programmiert werden, das notwendige Software-Updates und zusätzliche Funktionen enthält. (...)
Benutzerhandbuch: PDF | HTML
Software-Programmiertool

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

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Zertifizierung

SIMPLELINK-CC31XX-REPORTS Reports: CC31xx Regulatory Certification

Are you looking for CC3XXX certification support? SIMPLELINK-CC3XXX-CERTIFCATION provides the relevant information and support for successful certification of CC31XX, CC32XX, and CC33XX products. Within this page you will find the latest certification reports of our Modules as well as our (...)

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Unterstützte Produkte und Hardware

Zertifizierung

SIMPLELINK-CC3XXX-CERTIFICATION — Funkzertifizierung für SimpleLink™ CC3XXX

Suchen Sie nach Unterstützung bei der Zertifizierung für CC3XXX-Module? SIMPLELINK-CC3XXX-CERTIFICATION bietet die relevanten Informationen und Unterstützung für eine erfolgreiche Zertifizierung von CC31XX-, CC32XX- und CC33XX-Produkten. Auf dieser Seite finden Sie die neuesten (...)
Designtool

SIMPLELINK-WIFI-DESIGN-REVIEWS — Hardware-Designprüfungen für SimpleLink™ Wi-Fi -Bausteine

Der Überprüfungsprozess für das Hardwaredesign des CC3XXX WLAN stellt eine Möglichkeit bereit, direkt mit einem Fachexperten in Verbindung zu treten, der Sie bei der Prüfung Ihres Designs unterstützen und Ihnen ein wertvolles Feedback geben kann.  Bevor Sie eine Überprüfung anfordern, (...)
Benutzerhandbuch: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
QFM (MOB) 63 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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Support und Schulungen

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