CC1311P3

ACTIVO

Microcontrolador (MCU) inalámbrico SimpleLink™ Arm® Cortex®-M4 Sub-1 GHz con flash de 352 kB y ampli

Detalles del producto

Protocols 6LoWPAN, MIOTY, Proprietary, TI 15.4, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 143-176, 287-351, 359-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 40 Flash memory (kByte) 352 CPU Arm® Cortex®-M4 Operating system FreeRTOS, RTOS, TI-RTOS Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, 8-bit DAC, I2C, I2S Number of GPIOs 26 RX current (lowest) (mA) 5.4 Rating Catalog Operating temperature range (°C) -40 to 105
Protocols 6LoWPAN, MIOTY, Proprietary, TI 15.4, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 143-176, 287-351, 359-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 40 Flash memory (kByte) 352 CPU Arm® Cortex®-M4 Operating system FreeRTOS, RTOS, TI-RTOS Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, 8-bit DAC, I2C, I2S Number of GPIOs 26 RX current (lowest) (mA) 5.4 Rating Catalog Operating temperature range (°C) -40 to 105
VQFN (RGZ) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48MHz Arm Cortex-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 2.63mA active mode, CoreMark
    • 55µA/MHz running CoreMark
    • 0.7µA standby mode, RTC, 32KB RAM
    • 0.1µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 5.4mA RX at 868MHz
    • 24.9mA TX at +14dBm at 868MHz
    • 65mA TX at +20dBm at 915MHz

Wireless protocol support

High-performance radio

  • -121dBm for 2.5kbps long-range mode
  • -120dBm at 4.8kbps narrowband mode, 433MHz
  • -118dBm at 9.6kbps narrowband mode, 868MHz
  • -110dBm at 50kbps, 802.15.4, 868MHz
  • Output power up to +20dBm with temperature compensation
  • Down to 4kHz receiver filter bandwidth

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Analog Comparator
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8V to 3.8V single supply voltage
  • -40 to +105°C

Package

  • 7mm × 7mm RGZ VQFN48 (26 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48MHz Arm Cortex-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 2.63mA active mode, CoreMark
    • 55µA/MHz running CoreMark
    • 0.7µA standby mode, RTC, 32KB RAM
    • 0.1µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 5.4mA RX at 868MHz
    • 24.9mA TX at +14dBm at 868MHz
    • 65mA TX at +20dBm at 915MHz

Wireless protocol support

High-performance radio

  • -121dBm for 2.5kbps long-range mode
  • -120dBm at 4.8kbps narrowband mode, 433MHz
  • -118dBm at 9.6kbps narrowband mode, 868MHz
  • -110dBm at 50kbps, 802.15.4, 868MHz
  • Output power up to +20dBm with temperature compensation
  • Down to 4kHz receiver filter bandwidth

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Analog Comparator
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8V to 3.8V single supply voltage
  • -40 to +105°C

Package

  • 7mm × 7mm RGZ VQFN48 (26 GPIOs)
  • RoHS-compliant package

The SimpleLink™CC1311P3 device is a multiprotocol Sub-1GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack (Sub-1GHz). The CC1311P3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics, and medical applications.

The CC1311P3 has a software-defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 143MHz to 176MHz, 287MHz to 351MHz, 359MHz to 527-MHz, 861MHz to 1054MHz, and 1076MHz to 1315MHz frequency bands. The CC1311P3 has an efficient built-in PA that supports +14dBm TX at 24.9mA and +20dBm TX at 65mA. In RX, it has -121dBm sensitivity and 88dB blocking ±10MHz in SimpleLink™ long-range mode with 2.5kbps data rate.

The CC1311P3 has a low sleep current of 0.7µA with RTC and 32KB RAM retention.

Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC1311P3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1GHz MCUs, and host MCUs. CC1311P3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool support migration between devices in the portfolio. A comprehensive number of software stacks, application examples, and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™CC1311P3 device is a multiprotocol Sub-1GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack (Sub-1GHz). The CC1311P3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics, and medical applications.

The CC1311P3 has a software-defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 143MHz to 176MHz, 287MHz to 351MHz, 359MHz to 527-MHz, 861MHz to 1054MHz, and 1076MHz to 1315MHz frequency bands. The CC1311P3 has an efficient built-in PA that supports +14dBm TX at 24.9mA and +20dBm TX at 65mA. In RX, it has -121dBm sensitivity and 88dB blocking ±10MHz in SimpleLink™ long-range mode with 2.5kbps data rate.

The CC1311P3 has a low sleep current of 0.7µA with RTC and 32KB RAM retention.

Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC1311P3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1GHz MCUs, and host MCUs. CC1311P3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool support migration between devices in the portfolio. A comprehensive number of software stacks, application examples, and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet CC1311P3 SimpleLink™ High-Performance Sub-1GHz Wireless MCU with Integrated Power Amplifier datasheet (Rev. A) PDF | HTML 01 abr 2025
* Errata CC1311P3 Silicon Errata PDF | HTML 25 feb 2022
* User guide CC13x1x3, CC26x1x3 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 11 may 2022
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06 ago 2024
User guide SimpleLink CC131x and CC135x Family Hardware Migration Guide PDF | HTML 02 may 2024
Application brief Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A) PDF | HTML 09 abr 2024
Application note TI 15.4-Stack Software PDF | HTML 17 oct 2023
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 mar 2022
Application note 433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna PDF | HTML 07 feb 2022
Technical article Seamlessly connect your world with 16 new wireless MCUs for the 2.4-GHz and Sub-1- PDF | HTML 04 jun 2021
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 feb 2017

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Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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