CC2651P3

ACTIVO

MCU inalámbrica SimpleLink™ Arm® Cortex®-M4 de 32 bits y protocolo único a 2.4 GHz con memoria flash

Detalles del producto

CPU core Arm® Cortex®-M4 Technology 2.4 GHz, Bluetooth® LE, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 40 Peripherals 1 SPI, 1 UART, 12-bit ADC 8-channel, 2 comparators, 8-bit DAC, I2C, I2S Features 15.4G PHY, End device, MTD, NCP, Router, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 26 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure debug, Software IP protection Operating system FreeRTOS Type Wireless MCU Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105 Edge AI enabled No
CPU core Arm® Cortex®-M4 Technology 2.4 GHz, Bluetooth® LE, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 40 Peripherals 1 SPI, 1 UART, 12-bit ADC 8-channel, 2 comparators, 8-bit DAC, I2C, I2S Features 15.4G PHY, End device, MTD, NCP, Router, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 26 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure debug, Software IP protection Operating system FreeRTOS Type Wireless MCU Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105 Edge AI enabled No
VQFN (RGZ) 48 49 mm² 7 x 7 VQFN (RKP) 40 25 mm² 5 x 5

Wireless microcontroller

  • Powerful 48-MHz Arm Cortex-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 2.91 mA active mode, CoreMark
    • 61 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 6.4 mA RX
    • 7.1 mA TX at 0 dBm
    • 9.5 mA TX at +5 dBm
    • 22 mA TX at +10 dBm
    • 101 mA TX at +20 dBm (7x7 package)

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Analog Comparator
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • 5-mm × 5-mm RKP VQFN40 (18 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm Cortex-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 2.91 mA active mode, CoreMark
    • 61 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 6.4 mA RX
    • 7.1 mA TX at 0 dBm
    • 9.5 mA TX at +5 dBm
    • 22 mA TX at +10 dBm
    • 101 mA TX at +20 dBm (7x7 package)

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Analog Comparator
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • 5-mm × 5-mm RKP VQFN40 (18 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC2651P3 device is a single-protocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651P3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651P3 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651P3 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBm TX at 101 mA (7x7 package). CC2651P3 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651P3 has a low sleep current of 0.8 µA with RTC and 32KB RAM retention.

Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651P3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC2651P3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC2651P3 device is a single-protocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651P3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651P3 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651P3 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBm TX at 101 mA (7x7 package). CC2651P3 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651P3 has a low sleep current of 0.8 µA with RTC and 32KB RAM retention.

Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651P3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC2651P3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier datasheet PDF | HTML 30 mar 2022
* Errata CC2651P3 Silicon Errata PDF | HTML 30 mar 2022
* User guide CC13x1x3, CC26x1x3 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 11 may 2022
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06 ago 2024
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25 feb 2022
Application note Hardware Migration to CC2651R3 and CC2651P3 PDF | HTML 17 feb 2022
Application note RF PCB Simulation Cookbook 09 ene 2019
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 feb 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

LP-CC2651P3 — Kit de desarrollo LaunchPad™ CC2651P3 para MCU inalámbrico SimpleLink™ Multi-Standard

Este kit de desarrollo LaunchPad™ se utiliza para acelerar el desarrollo con el MCU inalámbrico SimpleLink™ Multi-Standard CC2651P3 con soporte para Bluetooth®, Zigbee® y Thread. El kit de desarrollo de software (SDK) SIMPLELINK-LOWPOWER-SDK proporciona soporte de software.

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Kit de desarrollo de software (SDK)

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Software de aplicación y estructura

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Ejemplo de código o demostración

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Primeros pasos

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CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

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SYSCONFIG Standalone desktop version of SysConfig

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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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