Detalles del producto

CPU 1 Arm Cortex-A8 Frequency (MHz) 800, 1000 Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
CPU 1 Arm Cortex-A8 Frequency (MHz) 800, 1000 Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBP) 515 144 mm² (12 mm × 12 mm) FCCSP (CUS) 423 256 mm² (16 mm × 16 mm) FCCSP (CBC) 515 196 mm² (14 mm × 14 mm)
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos DM3730, DM3725 Digital Media Processors datasheet (Rev. D) 11/04/2011
* Errata DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 13/02/2014
Nota sobre la aplicación OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles PDF | HTML 20/03/2019
Artículo técnico Enabling Wi-Fi® and Bluetooth® connectivity on RTOS PDF | HTML 13/04/2016
Artículo técnico Spring has sprung. A sale has sprung. PDF | HTML 4/04/2016
Nota sobre la aplicación Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 13/08/2015
Artículo técnico Selecting the right processor: WiLink 8 plug and play platforms PDF | HTML 26/06/2015
Nota sobre la aplicación PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 1/11/2013
Guía del usuario AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 10/09/2012
Guía del usuario Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 10/09/2012
Más documentación DM37x Design Network Partners 5/06/2012
Nota sobre la aplicación TI OMAP4430 POP SMT Design Guideline (Rev. C) 3/11/2011
Nota sobre la aplicación Introduction to TMS320C6000 DSP Optimization 6/10/2011
Nota sobre la aplicación PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 15/06/2011
Product overview DM3730 Product Bulletin 7/09/2010
Nota sobre la aplicación PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 23/06/2010
Nota sobre la aplicación PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 23/06/2010
Nota sobre la aplicación AM/DM37x Power Estimation Spreadsheet 7/06/2010
Nota sobre la aplicación AM/DM37x Overview 3/06/2010
Nota sobre la aplicación Setting up AM37x SDRC Registers 3/06/2010
Nota sobre la aplicación AM37x CUS Routing Guidelines 3/06/2010
Nota sobre la aplicación AM3715/03 Memory Subsystem 3/06/2010
Guía del usuario Flip Chip Ball Grid Array Package Reference Guide (Rev. A) 23/05/2005
Nota sobre la aplicación AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) 1/05/2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

BEACN-3P-TORPEDO — Sistema en módulo (SoM) Beacon EmbeddedWorks DM3730/AM3703 Torpedo™

El sistema en módulo (SoM) DM3730/AM3703 Torpedo es una plataforma compacta y lista para producción basada en los procesadores DaVinci™ DM3730 y Sitara™ AM3703 de Texas Instruments. Con tan solo 15 mm × 27 mm, Torpedo integra el procesador, la memoria, la administración de potencia y las funciones (...)

Productos y hardware compatibles
Kit de desarrollo de software (SDK)

ANDROIDEVKIT-FROYO — Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

Productos y hardware compatibles
Kit de desarrollo de software (SDK)

ANDROIDEVKIT-GINGERBREAD — Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

Productos y hardware compatibles
Kit de desarrollo de software (SDK)

LINUXDVSDK-DM37X — Kit de desarrollo de software de video digital (DVSDK) Linux para procesadores de medios digitales D

The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)

Productos y hardware compatibles
Controlador o biblioteca

TELECOMLIB — Bibliotecas de telecomunicaciones y medios: FAXLIB, VoLIB y AEC/AER para procesadores TMS320C64x+ y

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

Productos y hardware compatibles
Herramienta de programación de software

FLASHTOOL — FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

Productos y hardware compatibles
Modelo de simulación

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507 (9 KB) - Modelo BSDL
Productos y hardware compatibles
Modelo de simulación

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - Modelo IBIS
Productos y hardware compatibles
Modelo de simulación

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - Modelo BSDL
Productos y hardware compatibles
Modelo de simulación

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - Modelo IBIS
Productos y hardware compatibles
Modelo de simulación

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - Modelo BSDL
Productos y hardware compatibles
Modelo de simulación

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - Modelo IBIS
Productos y hardware compatibles
Diseño de referencia

TIDA-00408 — Diseño de referencia de respuesta háptica de pantalla táctil capacitiva para aplicaciones médicas y

The TIDA-00408 Touch Display with Haptic Feedback reference design showcases haptics for thermostats, building automation, factory automation, point of sale, and automotive applications.  The touch screen provides touch feedback when the user interacts with the on-screen user interface.  (...)

Productos y hardware compatibles
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
FCCSP (CBP) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian
FCCSP (CBC) 515 Ultra Librarian

Pedidos y calidad

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Soporte y capacitación

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