DM505

ACTIVO

SOC para análisis de visión en paquete de 15 mm

Detalles del producto

CPU 32-bit Display type Display subsystem Operating system Android, Linux, RTOS, TI RTOS Rating Catalog Operating temperature range (°C) -40 to 125
CPU 32-bit Display type Display subsystem Operating system Android, Linux, RTOS, TI RTOS Rating Catalog Operating temperature range (°C) -40 to 125
FCBGA (ABF) 367 225 mm² 15 x 15
  • Architecture Designed for Vision Analytics Applications
  • Video and Image Processing Support
    • Full-HD Video (1920 × 1080p, 60 fps)
    • Video Input and Video Output
  • Up to 2 C66x Floating-Point VLIW DSP
    • Fully Object-Code Compatible With C67x and C64x+
    • Up to Thirty-two 16 × 16-Bit Fixed-Point Multiplies per Cycle
  • Up to 512kB of On-Chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) Interconnects
  • Memory Interface (EMIF) Module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB Supported
  • Dual Arm® Cortex®-M4 Image Processor (IPU)
  • Vision AccelerationPac
    • Embedded Vision Engine (EVE)
  • Display Subsystem
    • Display Controller With DMA Engine
    • CVIDEO / SD-DAC TV Analog Composite Output
  • Video Input Port (VIP) Module
    • Support for up to 4 Multiplexed Input Ports
  • On-chip Temperature Sensor That is Capable of Generating Temperature Alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) Controller
  • 3-Port (2 External) Gigabit Ethernet (GMAC) Switch
  • Controller Area Network (DCAN) Module
    • CAN 2.0B Protocol
  • Modular Controller Area Network (MCAN) Module
    • CAN 2.0B Protocol
  • Eight 32-Bit General-Purpose Timers
  • Three Configurable UART Modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI Interface
  • Two Inter-Integrated Circuit (I2C) Ports
  • Three Multichannel Audio Serial Ports (McASP) Modules
  • MultiMedia Card/Secure Digital/Secure Digital Input Output Interface (MMC/SD/SDIO)
  • Up to 126 General-Purpose I/O (GPIO) Pins
  • Power, Reset, and Clock Management
  • On-Chip Debug With CTools Technology
  • Automotive AEC-Q100 Qualified
  • 15 × 15mm, 0.65-mm Pitch, 367-Pin PBGA (ABF)
  • 8-Channel 10-bit ADC
  • MIPI CSI-2 Camera Serial Interface
  • PWMSS
  • Full HW Image Pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and Perspective
  • Architecture Designed for Vision Analytics Applications
  • Video and Image Processing Support
    • Full-HD Video (1920 × 1080p, 60 fps)
    • Video Input and Video Output
  • Up to 2 C66x Floating-Point VLIW DSP
    • Fully Object-Code Compatible With C67x and C64x+
    • Up to Thirty-two 16 × 16-Bit Fixed-Point Multiplies per Cycle
  • Up to 512kB of On-Chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) Interconnects
  • Memory Interface (EMIF) Module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB Supported
  • Dual Arm® Cortex®-M4 Image Processor (IPU)
  • Vision AccelerationPac
    • Embedded Vision Engine (EVE)
  • Display Subsystem
    • Display Controller With DMA Engine
    • CVIDEO / SD-DAC TV Analog Composite Output
  • Video Input Port (VIP) Module
    • Support for up to 4 Multiplexed Input Ports
  • On-chip Temperature Sensor That is Capable of Generating Temperature Alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) Controller
  • 3-Port (2 External) Gigabit Ethernet (GMAC) Switch
  • Controller Area Network (DCAN) Module
    • CAN 2.0B Protocol
  • Modular Controller Area Network (MCAN) Module
    • CAN 2.0B Protocol
  • Eight 32-Bit General-Purpose Timers
  • Three Configurable UART Modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI Interface
  • Two Inter-Integrated Circuit (I2C) Ports
  • Three Multichannel Audio Serial Ports (McASP) Modules
  • MultiMedia Card/Secure Digital/Secure Digital Input Output Interface (MMC/SD/SDIO)
  • Up to 126 General-Purpose I/O (GPIO) Pins
  • Power, Reset, and Clock Management
  • On-Chip Debug With CTools Technology
  • Automotive AEC-Q100 Qualified
  • 15 × 15mm, 0.65-mm Pitch, 367-Pin PBGA (ABF)
  • 8-Channel 10-bit ADC
  • MIPI CSI-2 Camera Serial Interface
  • PWMSS
  • Full HW Image Pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and Perspective

The DM505 is a highly optimized device for Vision Analytics and Machine Vision processing in Industrial products such as drones, robots, forklifts, railroad and agriculture equipment. The Processor enables sophisticated embedded vision processing integrating an optimal mix of real time performance, low power, small form factor and camera processing for systems to interact in more intelligent, useful ways with the physical world and the people in it.

The DM505 incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power designs to meet demanding embedded system budgets without sacrificing real-time processing performance to enable small form factor designs. The DM505 also integrates a host of peripherals including interfaces for multi-camera input (both parallel and serial), display outputs, audio and serial I/O, CAN and GigB Ethernet AVB.

TI provides application specific hardware and software through our Design Network Partners and a complete set of development tools for the Arm, and DSP, including C compilers with TI RTOS to accelerate time to market.

The DM505 is a highly optimized device for Vision Analytics and Machine Vision processing in Industrial products such as drones, robots, forklifts, railroad and agriculture equipment. The Processor enables sophisticated embedded vision processing integrating an optimal mix of real time performance, low power, small form factor and camera processing for systems to interact in more intelligent, useful ways with the physical world and the people in it.

The DM505 incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power designs to meet demanding embedded system budgets without sacrificing real-time processing performance to enable small form factor designs. The DM505 also integrates a host of peripherals including interfaces for multi-camera input (both parallel and serial), display outputs, audio and serial I/O, CAN and GigB Ethernet AVB.

TI provides application specific hardware and software through our Design Network Partners and a complete set of development tools for the Arm, and DSP, including C compilers with TI RTOS to accelerate time to market.

The DM505 is a highly optimized device for Vision Analytics and Machine Vision processing in Industrial products such as drones, robots, forklifts, railroad and agriculture equipment. The Processor enables sophisticated embedded vision processing integrating an optimal mix of real time performance, low power, small form factor and camera processing for systems to interact in more intelligent, useful ways with the physical world and the people in it.

The DM505 incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power designs to meet demanding embedded system budgets without sacrificing real-time processing performance to enable small form factor designs. The DM505 also integrates a host of peripherals including interfaces for multi-camera input (both parallel and serial), display outputs, audio and serial I/O, CAN and GigB Ethernet AVB.

TI provides application specific hardware and software through our Design Network Partners and a complete set of development tools for the Arm, and DSP, including C compilers with TI RTOS to accelerate time to market.

The DM505 is a highly optimized device for Vision Analytics and Machine Vision processing in Industrial products such as drones, robots, forklifts, railroad and agriculture equipment. The Processor enables sophisticated embedded vision processing integrating an optimal mix of real time performance, low power, small form factor and camera processing for systems to interact in more intelligent, useful ways with the physical world and the people in it.

The DM505 incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power designs to meet demanding embedded system budgets without sacrificing real-time processing performance to enable small form factor designs. The DM505 also integrates a host of peripherals including interfaces for multi-camera input (both parallel and serial), display outputs, audio and serial I/O, CAN and GigB Ethernet AVB.

TI provides application specific hardware and software through our Design Network Partners and a complete set of development tools for the Arm, and DSP, including C compilers with TI RTOS to accelerate time to market.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet DM505 SoC for Vision Analytics 15mm Package (ABF) Silicon Revision 2.0 datasheet (Rev. E) PDF | HTML 02 may 2018
* Errata DM50x Silicon Errata (Rev. A) 23 feb 2018
User guide Clock Tree Tool User Manual (Rev. I) 24 jun 2020
User guide DM50x SoC for Vision Analytics Technical Reference Manual (Rev. B) 28 oct 2017
More literature Vision Library (VLIB) for C64x+/C674x/C66x Processors 24 ene 2017
User guide Pad Configuration Tool User Manual 16 nov 2016
Application note Introduction to TMS320C6000 DSP Optimization 06 oct 2011

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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Guía del usuario: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
FCBGA (ABF) 367 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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