TMUXHS5212
- Provides 2 differential-channels of bidirectional 2:1 mux or 1:2 demux
- Suitable for interfaces with datarates up to
32Gbps NRZ
- Supports PCIe 5.0 (32 GT/s), USB 4.0, CXL 3.1, TBT 4, SATA 3, SAS-4, DSI/CSI, and Ethernet applications
- −3dB differential BW of 18.5GHz typ
- Dynamic characteristics at 16GHz typ:
- Insertion loss = −2.75dB
- Return loss = −17dB
- Crosstalk = −30dB
- Minimal skew:
- Bit-to-Bit = 3ps typ
- Channel-to-Channel = 10ps typ
- Supports common mode voltages from 0 to 1.2V
- Single supply voltage VCC of 1.8V
- Adaptive common mode voltage tracking
- Low active (60µA typ) and standby current consumption (1µA typ)
- Temperature range of −40° to 105°C
- Available in 2.5mm × 2.5mm QFN package with 0.35mm pitch
The TMUXHS5212 is a 2-channel bidirectional passive switch with 2:1 mux or 1:2 demux configurations. It supports differential signaling up to 32GBbps NRZ, thus enabling it for many applications including PCI Express 5.0, USB 4, 50G Ethernet, CXL 3.1 and Thunderbolt™ 4. The device operates off of a 1.8V supply with ultra low active and standby power, and its control pins are compatible with 1.8V digital inputs.
The dynamic characteristics of the TMUXHS5212 allow for high-speed switching with minimal attenuation and negligible added jitter to the eye diagram for both NRZ and PAM applications. It is designed for best intra-pair skew performance, low crosstalk, and reliable signal integrity.
The TMUXHS5212 is rated for a temperature range of -40°C to 105°C that can suit commercial, industrial and personal electronics applications.
技術資料
| 上位の文書 | タイプ | タイトル | フォーマットオプション | 最新の英語版をダウンロード | 日付 | |
|---|---|---|---|---|---|---|
| * | データシート | TMUXHS5212 32Gbps Two-Channel Differential 2:1 Mux or 1:2 Demux データシート | PDF | HTML | 2026/07/31 |
設計と開発
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TMUXHS5212-EVM — TMUXHS5212 evaluation module
The TMUXHS5212-EVM is used to evaluate the high- speed signaling performance of the TMUXHS5212. The evaluation module (EVM) comes with a soldered unit. The EVM allows for engineers to evaluate the signal performance passing through the multiplexer compared to just a trace. The I/Os are tied through (...)
| パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
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